Single in-line optical package
AssigneeAT&T Bell Laboratories
InventorsAlbert M. Benzoni, Mindaugas F. Dautartas
Life of this patent
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Abstract
An optical packaging arrangement is disclosed which utilizes silicon technology and overmolding techniques to provide a single in-line package with completely passive alignment between the various optical components. The technique as disclosed is useful in the packaging of a single active optical device and associated electronics, a pair of optical devices and electronics (transceiver), or an array of any desired number of such components. Since the silicon may be processed to include etched alignment fiducials and metallized bond pad sites, solder bump self-alignment and silicon optical bench technology may be used to provide for alignment between the active device, coupling lens and associated optical fiber.
Claims13
An optical package comprising
- a silicon substrate defined as comprising a top major surface;
- a plurality of metallized bond pad sites formed on said top major silicon surface;
- at least one active optical device attached and electrically connected to said top major silicon surface;
- electronic circuitry attached to said top major silicon surface for operating said at least one active optical device;
- means for electrically connecting said electronic circuitry between the plurality of metallized bond pad sites and the at least one active optical device;
- a plurality of alignment fiducials formed in said top major silicon surface at predetermined locations with respect to the location of said at least one active optical device;
- optical receptacle means for providing coupling between an optical fiber and said at least one active optical device, said optical receptacle means including alignment fiducials which mate with said optical device alignment fiducials upon attachment and provide optical alignment between said at least one active optical device and said optical receptacle means;
- and
- outer packaging formed so as to completely enclose said silicon substrate and a portion of said optical receptacle means.
A method for packaging an optical communication arrangement, the method comprising the steps of:
- a) providing a silicon substrate, including a dielectric surface layer, and defined as comprising a top major surface;
- b) forming alignment fiducials at predetermined locations on said top major surface of said silicon substrate;
- c) metallizing said silicon top major surface so as to define electrical signal paths and solder bump connection sites;
- d) providing electronic circuits and optical components which include electrical connection sites on the undersides thereof;
- e) placing the electronic circuits and optical components provided in step d) on said silicon top major surface;
- f) heating the arrangement of step e) to a temperature sufficient to cause the solder bumps to re-flow and provide electrical and physical coupling of the electronic circuits and optical components to said silicon substrate;
- g) providing optical receptacle means which functions to provide coupling between an optical fiber and said optical components, said optical receptacle means including alignment fiducials which mate with the alignment fiducials formed in step b);
- h) attaching said optical receptacle means to said substrate so as to provide physical attachment of the aligned fiducials and optical alignment between said optical components and said optical receptacle means;
- and
- i) enclosing the arrangement of step h) to provide a packaged optical communication arrangement.
Dependencies are inferred from the claim text.