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US 5,335,361 AGranted
Integrated circuit module with devices interconnected by electromagnetic waves
AssigneeMotorola, Inc.
InventorSanjar Ghaem
Life of this patent
Estimating the term…
Abstract
An integrated circuit module (501), with enclosed semiconductor devices (107, 115), includes a housing (101) with an electromagnetic wave reflective interior surface (103). A transmitter (105), mounted on a semiconductor device (107), transmits signals derived from a semiconductor device (107). An electromagnetic wave receiver (113), is positioned in the housing (101) such that it receives a transmitted wave via a reflective surface (103) along an electromagnetic wave path (117) from the transmitter (105).
Claims26
An integrated circuit module comprising:
- a housing having at least one electromagnetic wave reflective interior surface;
- an essentially planar substrate having a first and an opposing second surface, said first and opposing second surfaces disposed inside said housing;
- a first conductor disposed on said first surface;
- a first semiconductor device disposed on said first surface and connected to said first conductor;
- an electromagnetic wave transmitter, for sending information signals derived from said first semiconductor device, disposed on said first surface and coupled to said first conductor;
- a second conductor disposed on said opposing second surface;
- a second semiconductor device disposed on said opposing second surface and connected to said second conductor;
- and
- an electromagnetic wave receiver disposed on said opposing second surface and coupled to said second conductor, said electromagnetic wave receiver receiving said information signals from said electromagnetic wave transmitter and providing said information signals to said second semiconductor device, wherein said electromagnetic wave transmitter, said at least one electromagnetic wave reflective interior surface, and said electromagnetic wave receiver are positioned to establish an electromagnetic wave path for communicating said information signals from said electromagnetic wave transmitter, via said at least one electromagnetic wave reflective interior surface, to said electromagnetic wave receiver.
6 more elements
An integrated circuit module comprising:
- a housing;
- an essentially planar, electromagnetic wave transparent, substrate having a first and opposing second surface, said first and opposing second surfaces disposed in said housing;
- a first conductor for carrying power disposed on said first surface;
- an electromagnetic wave transmitter, for transmitting information signals, disposed on said first surface and connected to said first conductor;
- a second conductor for carrying power disposed on said opposing second surface;
- and
- an electromagnetic wave receiver disposed on said opposing second surface and coupled to said conductor, wherein said electromagnetic wave transmitter, said essentially planer electromagnetic wave transparent substrate and said electromagnetic wave receiver are positioned to establish a substantially straight electromagnetic wave path through said essentially planer, electromagnetic wave transparent, substrate for communicating said information signals from said electromagnetic wave transmitter through said essentially planar, electromagnetic wave transparent, substrate to said electromagnetic wave receiver.
4 more elements
An integrated circuit module comprising:
- an essentially planar, electromagnetic wave transparent, substrate having a first and an opposing second sun ace, said first and second surfaces disposed inside a housing;
- a first semiconductor device having at least two corners and disposed on said first surface and wherein at least one of an electromagnetic wave transmitter/receiver is positioned at each of said at least two corners;
- a second semiconductor device having at least two corners and disposed on said first surface and wherein at least one to an electromagnetic wave transmitter/receiver is positioned at each to said at least two corners;
- and
- a third semiconductor device having at least two corners and disposed on said second surface and wherein at least one of an electromagnetic wave transmitter/receiver is positioned at each of said at least two corners so as to communicate via a direct path with said at least one of an electromagnetic wave transmitter/receiver of said first semiconductor device and via a direct path with said at least one of an electromagnetic wave transmitter/receiver of said second semiconductor device.
2 more elements
Dependencies are inferred from the claim text.