Electronic device package

An electronic package comprising:

• a first base substrate having an aperture which defines a cavity;
• a semiconductor device having an electrical contact pad, said device disposed within said cavity such that said device is substantially enclosed within said cavity leaving substantially no voids in said cavity;
• a second base substrate which is directly fusible to said first base substrate, said second base substrate encapsulating said semiconductor device;
• a substrate conductor path which extends from a cavity conductor pad through said first base substrate to an exterior conductor pad;
• and
• a conducting interconnector sandwiched between said device electrical contact pad and said cavity conductor pad, thus forming an electrical connection between said semiconductor device and said exterior conductor pad.

An electronic package comprising:

• a first base substrate having an aperture which defined a cavity;
• a semiconductor device having an electrical contact pad, said device disposed within said cavity such that said device is substantially enclosed within said cavity leaving substantially no voids in said cavity;
• a second base substrate which is directly fusible to said first base substrate, said second base substrate encapsulating said semiconductor device;
• a substrate conductor path which extends from a cavity conductor pad through said second base substrate to an exterior conductor pad;
• and
• a conducting interconnector sandwiched between said device electrical contact pad and said cavity conductor pad, thus forming an electrical connection between said semiconductor device and said exterior conductor pad.

An IC package comprising:

• a semiconductor device having an electrical connector pad;
• a body member, said body member comprising:
• an interior chamber having substantially the identical shape and size of said semiconductor device for encapsulating said semiconductor device within said chamber with substantially no voids;
• and
• a conducting path extending from an exterior surface of said body member to a chamber electrical connector pad on an interior surface of said interior chamber;
• and
• an conductive material sandwiched between said chamber electrical connector pad on said interior surface of said interior chamber and said electrical connector pad on said semiconductor device.

An IC package comprising:

• a semiconductor device having at least three electrical connector pads;
• and
• a body member, said body member comprising:
• an interior chamber having substantially the identical shape and size of said semiconductor device for encapsulating said semiconductor device within said chamber with substantially no voids;
• and
• at least three conducting paths extending from outside of said body member to at least three chamber electrical connector pads inside of said interior chamber which are in alignment with said electrical connector pads on said semiconductor device.