# US 5,334,800 A · Flexible shielded circuit board

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- Number: US 5,334,800 A
- Document ID: US5334800A
- Status: Granted
- Kind: A
- Application number: 08/095,287
- Filed: 1993-07-21
- Granted: 1994-08-02
- Earliest claimed: 1993-07-21
- Assignees: Parlex Corporation
- Inventors: Stephen O. Kenney
- Web page: https://patentgrep.com/patent/US5334800A

## CPC

- H05K 1/0224: {Patterned shielding planes, ground planes or power planes (H05K1/0253 takes precedence)}
- H05K 1/0253: {Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K1/0251 takes precedence)}
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- H05K 2201/0715: provided by an outer layer of PCB
- H05K 2201/09681: Mesh conductors, e.g. as a ground plane
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A flexible circuit board providing the dual benefits of flexibility and shielding against incidental radiation. The flexible, shielded circuit board includes a number of electrical conductors disposed in a substrate, substantially parallel to opposing surfaces of the substrate. Electrical shield layers in the form of a mesh or grid are disposed on the substrate surfaces and are preferably formed by screen printing a conductive layer on each side of the substrate. A repeating pattern of shield conductors, shield conductor vertices, and voids in the shield layer through which the substrate is exposed is thus created on either side of the substrate.

## Claims

### Claim 1

A flexible, shielded circuit board comprising:
a substrate having first and second opposing substantially planar surfaces and one or more conductors disposed in the substrate; and
first and second shield layers comprised of electrically conductive material respectively disposed on said first and second planar surfaces, said first and second shield layers each having a mesh pattern of voids and conductive regions, said voids being defined by said conductive regions;
the mesh pattern of said first shield layer being offset from the mesh pattern of said second shield layer.

### Claim 2 (depends on 1)

The circuit board of claim 1 wherein at least one of said first and second shield layers include screen printed conductive silver epoxy.

### Claim 3 (depends on 1)

The circuit board of claim 1 wherein said substrate layer includes a homogenous material forming a substantially uniform substrate layer.

### Claim 4 (depends on 3)

The circuit board of claim 3 wherein said homogenous material forms said substrate layer and encases said shield layers.

### Claim 5 (depends on 1)

The flexible circuit of claim 1 wherein said conductors include a plurality of conductors, and wherein the first and last ones of said plurality of conductors are electrically connected to said first and second shield layers.

### Claim 6 (depends on 1)

The flexible circuit of claim 1 wherein said mesh pattern includes a regularly spaced of generally square voids spaced equidistantly in the planes of the shield layers.

### Claim 7 (depends on 6)

The flexible circuit of claim 6 wherein said regularly spaced pattern of said first and second shield layers is about 40% to 60% voids in surface area.

### Claim 8 (depends on 1)

The flexible circuit of claim 1 wherein said voids in said first shield layer are generally vertically aligned with vertices in the conductive regions of said second shield layer, and said voids in said second shield layer are generally vertically aligned with vertices in the conductive regions of said first shield layer.

### Claim 9 (depends on 8)

The flexible circuit of claim 8 wherein each of said conductors is generally vertically aligned with the vertices and voids in the first and second shield layers.