Polyimide resin laminates

A thermosetting resin composition consisting essentially of:

• (a) a bisimide having the formula:
• ##STR9## where A comprises at least one of alkylene radicals having 1 to 20 carbon atoms, cycloalkylene radicals having 4 to 40 carbon atoms, heterocyclic radicals containing at least one of O, S, and N, and phenylene or polycyclic aromatic radicals
• D is a divalent radical containing a carbon-carbon double bond;
• b) a reactive brominated aromatic compound selected from the group consisting of imides, styrenes, and acrylates;
• wherein said imides have the formula ##STR10## where R.sub.5, is independently selected from the group consisting of H and lower alkyl
• a is an integer from 1 to 5;
• and
• wherein said styrenes have the formula ##STR11## where R.sub.6 is independently selected from the group consisting of H and lower alkyl
• b is an integer from 1 to 5;
• and
• wherein said acrylates have the formula ##STR12## where R.sub.7 is independently selected from the group consisting of H and lower alkyl;
• c is an integer from 1 to 5;
• (c) dicyandiamide;
• and (d) with or without ethylene bistetrabromophthalimide.