Epoxy resin/phenolic OH-aramid/ban block copolymer product with CTBN
AssigneesTomoegawa Paper Co., Ltd., Mitsukazu Ochi
InventorsMitsukazu Ochi, Toshio Tagami, Osamu Kiyohara
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AssigneesTomoegawa Paper Co., Ltd., Mitsukazu Ochi
InventorsMitsukazu Ochi, Toshio Tagami, Osamu Kiyohara
Estimating the term…
An epoxy resin modified material is disclosed, which is obtained by reacting an epoxy resin and a phenolic hydroxyl group-containing aramid/polybutadiene-acrylonitrile block copolymer represented by formula (I): ##STR1## wherein Ar.sup.1 and Ar.sup.3 each represent a divalent aromatic group; Ar.sup.2 represents a phenolic hydroxyl group-containing divalent aromatic group; x represents an integer of from 3 to 7; y represents an integer of from 1 to 4; y/(x+y) is from 0.1 to 0.3; z represents an integer of from 5 to 15; m represents an integer of from 1 to 400; n represents an integer of from 1 to n/(m+n) is from 0.01 to 0.50; and l represents an integer of from 1 to 50. An epoxy resin composition containing the epoxy resin modified material and a carboxyl-terminated polybutadiene-acrylonitrile copolymer is useful as a cationic electrodeposition coating.
An epoxy resin composition comprising:
Dependencies are inferred from the claim text.