# US 5,334,422 A · Electrical connector having energy-formed solder stops and methods of making and using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,334,422 A - Document ID: US5334422A - Status: Granted - Kind: A - Application number: 08/013,851 - Filed: 1993-02-05 - Granted: 1994-08-02 - Earliest claimed: 1991-10-28 - Assignees: Delco Electronics Corporation - Inventors: Bruce A. Myers; John K. Isenberg; Christine R. Coapman; James A. Blanton - Web page: https://patentgrep.com/patent/US5334422A ## CPC - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H05K 1/092: {Dispersed materials, e.g. conductive pastes or inks} - H05K 3/22: Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} - H05K 3/3452: Solder masks - H10W 72/07236: {Soldering or alloying} - Y10T 29/49121: Beam lead frame or beam lead device - Y10T 29/49126: Assembling bases - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method of forming solder stops on a thick film, comprising a conductive metal and an inorganic oxide, including the step of directing a laser beam onto the film to form a surface consisting essentially of fused inorganic oxides which acts as a solder stop. ## Claims ### Claim 1 A method of forming an electrically conductive lead having a solder stop and solder thereon comprising the steps of: providing a conductive composition comprising a conductive material and an inorganic oxide; printing said conductive composition on a substrate to form a wet printed pattern having a top surface; sintering said printed pattern to form a conductive lead having a first top surface; and energizing a portion of said sintered pattern to provide a second top surface of said printed pattern consisting essentially of fused inorganic oxide from the sintered lead, the first and second top surfaces being in substantially the same plane and so that a solder stop is formed at said second top surface, and forming a solder bump on said first top surface immediately adjacent said solder stop, and causing the solder bump to flow wherein said stop prevent the solder from flowing onto said portion of the lead. ### Claim 2 (depends on 1) A method as set forth in claim 1 wherein said step of energizing comprises heating. ### Claim 3 (depends on 1) A method of as set forth in claim 1 wherein said step of energizing comprises directing a laser beam onto said portion. ### Claim 4 (depends on 1) A method of forming an electrically conductive lead as set forth in claim 1 wherein said step of energizing comprises directing a laser beam onto said portion. ### Claim 5 (depends on 4) A method as set forth in claim 4 wherein said laser imparts energy ranging from about 0.0005 joule to about 0.100 joule onto said portion of said printed pattern. ### Claim 6 (depends on 5) A method as set forth in claim 5 wherein said conductive material comprises at least one selected from the group consisting of silver, palladium, platinum, gold, and copper. ### Claim 7 (depends on 5) A method as set forth in claim 5 wherein said inorganic oxide comprises at least one selected from the group consisting of lead, ruthenium, cobalt, bismuth, copper, and zinc oxides. ### Claim 8 (depends on 5) A method as set forth in claim 5 wherein said inorganic oxide is present in an amount ranging from about 3% to about 40% by weight of said composition. ### Claim 9 (depends on 1) A method as set forth in claim 1 wherein said step of energizing comprises directing wave energy onto said pattern. ### Claim 10 (depends on 1) A method as set forth in claim 1 wherein said step of energizing comprises directing an electron beam onto said pattern. ### Claim 11 A method of forming an integrated circuit chip assembly comprising the steps of: providing an integrated circuit chip having connector pads for electrically connecting the integrated circuit of said chip to an external source of electricity; providing a composition comprising a conductive material and an inorganic oxide; applying said composition on a substrate to form a wet printed lead having a top surface and an end; forming a flexible solder bump on the contactor pads of said integrated circuit chip; sintering said printed pattern to form a cohesive electrically conductive lead; forming a solder stop in a portion of the sintered lead by the step consisting essentially of directing a laser beam onto said portion of the sintered lead to form a solder stop surface consisting essentially of fused inorganic oxides; wherein said portion of said printed lead between the end of the lead and said solder stop defines a contact region for said solder bump; aligning said integrated circuit chip so that said flexible solder bump contacts said contact region of said electrically conductive lead; and reflowing said flexible solder bump, wherein the solder does not flow over the solder stop, and cooling the solder so that said integrated circuit is secured to said electrically conductive lead. ### Claim 12 A method of forming an electrically conductive lead having a solder stop and solder thereon comprising the steps of: providing a composition comprising a conductive material and an inorganic oxide; printing said composition onto a substrate to form a printed pattern having a top surface; sintering said printed pattern to form a conductive lead; the step consisting essentially of vaporizing the conductive material from a portion of the top surface of said printed pattern to form a solder stop, consisting essentially of fused inorganic oxides; forming a solder bump on the lead adjacent the solder stop, reflowing the solder bump, wherein solder does not flow over the solder stop, and cooling the solder so that it is secured to the lead.