Magnetron sputtering apparatus and sputtering gun for use in the same

A magnetron sputtering gun for emitting sputter particles towards an object to be processed situated within the vacuum chamber, comprising:

• a target having a recess opening to the object;
• a sputtering gas supply source for supplying a sputtering gas from a bottom of the recess;
• an electric field producing mechanism for producing an electric field in the recess, thereby producing a plasma of the sputtering gas;
• and
• a magnetic field producing mechanism for producing, in the recess, a magnetic field including a component intersecting the electric field at right angles,
• wherein the pressure within the recess is set at a higher value than that within the vacuum chamber, and thereby a pressure gradient is created from the recess towards the vacuum chamber, and the sputter particles are emitted from the target into the vacuum chamber by the plasma produced in the recess.

A magnetron sputtering apparatus for forming a sputtering film on an object, comprising:

• (a) a vacuum chamber for accommodating the object;
• (b) a plurality of sputtering guns for emitting sputtering particles to the object, each sputtering gun having,
• a target having a recess opening to the object,
• a sputtering gas supply source for supplying a sputtering gas into the recess,
• an electric field producing mechanism for producing an electric field in the recess, thereby producing a plasma of the sputtering gas, and
• a magnetic field producing mechanism for producing, in the recess, a magnetic field including a component intersecting the electric field at right angles;
• (c) a support member for supporting the object within the vacuum chamber;
• (d) a reaction gas supply source for supplying a reaction gas to the sputter particles emitted from each of said sputtering gun into the vacuum chamber;
• and
• (e) a mechanism for moving the sputtering guns and the support member relative to each other,
• wherein the sputter particles react with the reaction gas within the vacuum chamber, and a resultant reaction produce is deposited on the object.

A magnetron sputtering apparatus for forming a sputtering film on an object, comprising:

• (a) a vacuum chamber for accommodating the object;
• (b) a plurality of sputtering guns for emitting sputter particles to the object, each sputtering gun having,
• a target having a recess opening to the object;
• a sputtering gas supply source for supplying a sputtering gas from a bottom of the recess,
• an electric field producing mechanism for producing an electric field in the recess, thereby producing a plasma of the sputtering gas, and
• a magnetic field producing mechanism for producing, in the recess, a magnetic field including a component intersecting the electric field at right angles;
• (c) a support member for supporting the object within the vacuum chamber;
• and
• (d) a mechanism for moving the sputtering guns and the support member relative to each other,
• wherein the pressure within the recess is set at a higher value than that within the vacuum chamber, and thereby a pressure gradient is created from the recess towards the vacuum chamber, and the sputter particles are emitted from the target into the vacuum chamber by the plasma produced in the recess.

A magnetron sputtering gun for emitting sputter particles towards an object situated within the vacuum chamber, comprising:

• a target having a recess opening to the object;
• a sputtering gas supply source for supplying a sputtering gas from a bottom of the recess;
• an electric field producing mechanism for producing an electric field in the recess, thereby producing a plasma of the sputtering gas;
• an magnetic field producing mechanism for producing, in the recess, a magnetic field including a component intersecting the electric field at right angles;
• and
• a reaction gas supplying source for supplying a reaction gas to the sputter particles emitted from the target in a region apart from the plasma,
• wherein the sputter particles react with the reaction gas, and a resultant reaction product is formed.