Wafer bonding using trapped oxidizing vapor
AssigneeHarris Corporation
InventorsJohn P. Short, Craig J. McLachlan, George V. Rouse, James R. Zibrida
Life of this patent
Estimating the term…
Abstract
A bonding method including pressing a pair of slices together with a liquid oxidant therebetween and subjecting the pair of slices to a temperature to bond the slices together. Preferably a liquid oxidant is applied to one of the slices before they are pressed together and then dried. The heating step for bonding is carried out at a sufficiently high temperature of at least 1100.degree. C. to make the slices pliable so as to comply with each other during the bonding step.
Claims23
A method of forming bonded wafers from two slices comprising:
- pressing a pair of slices together at bonding surfaces with a predetermined quantity of oxidant therebetween;
- and
- heating said pair of slices to bond said slices together.
A method of forming a bonded wafer from a pair of slices comprising:
- applying a predetermined quantity of oxidant to a bonding surface of one of said slices;
- pressing said pair of slices together at said bonding surface with said oxidant therebetween;
- and
- heating said pair of slices at a temperature sufficient to make the slices pliable and for a sufficient time to bond the slices together.
Dependencies are inferred from the claim text.