# US 5,333,375 A · Substrate lead strip mounting machine and method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,333,375 A - Document ID: US5333375A - Status: Granted - Kind: A - Application number: 08/122,389 - Filed: 1993-09-16 - Granted: 1994-08-02 - Earliest claimed: 1993-09-16 - Assignees: Die Tech, Inc. - Inventors: Richard K. Dennis; Wade D. Myers; James A. Riddle - Web page: https://patentgrep.com/patent/US5333375A ## CPC - H10P 72/0444: {Apparatus for wiring semiconductor or solid-state device} - Y10T 29/49121: Beam lead frame or beam lead device - Y10T 29/5137: including assembling or disassembling station - Y10T 29/5142: and means to sever work from supply - Y10T 29/53261: Means to align and advance work part - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An apparatus and method for simultaneously mounting lead strip segments onto each side of a rectangular ceramic substrate. Four lead strip mounting assemblies are equally spaced 90 degrees apart around a central vertically oriented substrate support so that each assembly is perpendicular an edge of a substrate on the support. Lead strip feed assemblies located adjacent each mounting assemblies cuts lead strip segments and feeds the lead strip segments into the mounting assemblies. The four mounting assemblies simultaneously mount the lead strip segments on the substrate. ## Claims ### Claim 1 Apparatus for simultaneously mounting lead strip segments of the type having a carrier strip and a plurality of leads extending from one side of the carrier strip to contact portions on the free ends of the leads on the edges of rectangular integrated circuit substrates with the contact portions of the leads engaging contact pads spaced along the edges of the substrates, the apparatus including, a) an integrated circuit substrate support located on a central axis; b) a plurality of transport assemblies spaced around the central axis with each transport assembly located outwardly of the substrate support, each transport assembly including a transport head movable between a loading position away from the axis and a mounting position adjacent the axis, lead strip segment clamp means for securing a lead strip segment to the head at a location facing the axis for mounting on the edge of an integrated circuit substrate on the substrate support; c) lead strip segment feed means for feeding a lead strip segment to each transport head when in the loading position; d) a transport head drive for moving said transport heads simultaneously between said loading position and said mounting position, said transport head drive including an extendable and retractable first drive member, first drive means for extending and retracting the first drive member and first operative connections joining the first drive member and each transport head; and e) clamp drive means for releasing the clamp means in each transport assembly simultaneously when the transport heads are in the mounting position. ### Claim 2 (depends on 1) Apparatus as in claim 1 wherein said substrate support means includes a vacuum recess, and including a vacuum source and a vacuum line communicating said source and the vacuum recess. ### Claim 3 (depends on 2) Apparatus as in claim 2 wherein said vacuum line includes a first tube extending along said axis. ### Claim 4 (depends on 3) Apparatus as in claim 3 wherein said first drive member is adjacent and movable along said axis. ### Claim 5 (depends on 4) Apparatus as in claim 4 wherein said first drive means comprises a fluid cylinder on said axis, said vacuum line extending through said fluid cylinder; and said first drive member comprises a second tube surrounding said first tube. ### Claim 6 (depends on 1) Apparatus as in claim 1 wherein said first drive member is movable along the axis and each first operative connection mechanically joins the first drive member and a transport assembly. ### Claim 7 (depends on 6) Apparatus as in claim 6 wherein said first drive means comprises a fluid cylinder mounted on said axis, said cylinder including a piston movable along the axis and wherein said first drive member is connected to the piston. ### Claim 8 (depends on 7) Apparatus as in claim 7 wherein each operative connection comprises a connection member pivotedly connected to the first drive member and a transfer head. ### Claim 9 (depends on 8) Apparatus as in claim 8 wherein each connection member is pivotedly connected to the apparatus. ### Claim 10 (depends on 9) Apparatus as in claim 9 wherein each connection member is pivotedly connected to the apparatus between the connections to the drive member and transfer head. ### Claim 11 (depends on 8) Apparatus as in claim 8 including four transport assemblies arranged 90 degrees apart around the axis. ### Claim 12 (depends on 11) Apparatus as in claim 11 including four lead strip feed and cut-off assemblies arranged 90 degrees apart around the axis, each such assembly being associated with one of said transport assemblies and located between two adjacent transport assemblies. ### Claim 13 (depends on 1) Apparatus as in claim 1 wherein said clamp drive means includes an extendable and retractable second drive member, second drive means for extending and retracting the second drive member, and second operative connections joining said second drive member and each clamp means. ### Claim 14 (depends on 13) Apparatus as in claim 13 wherein said first drive member and said second drive member are movable along the axis. ### Claim 15 (depends on 14) Apparatus as in claim 14 wherein each first operative connection mechanically joins said first drive member and a transport head and each second operative connection mechanically joins the second drive member and each clamp means. ### Claim 16 (depends on 15) Apparatus as in claim 15 wherein said first head drive means includes a first tube surrounding the axis and second drive means includes a second tube surrounding said axis. ### Claim 17 (depends on 16) Apparatus as in claim 16 wherein said first drive means includes a first fluid cylinder on said axis connected to said first tube and said second drive means includes a second fluid cylinder on said axis connected to said second tube, one of said tubes extending through one of said cylinders. ### Claim 18 (depends on 1) Apparatus as in claim 1 wherein each transport assembly includes means for aligning a lead strip segment on the transport head with the free ends of the leads in alignment for engagement with contact pads on the edge of a substrate held on the substrate support. ### Claim 19 (depends on 18) Apparatus as in claim 18 wherein the clamp means comprises a clamp hingeably mounted to the transport head, a spring biasing the clamp against the head to hold a lead strip segment in place on the head, and the clamp drive means includes a lift member movably mounted on the head, and a lift member drive for shifting the lift member to engage the clamp and rotate the clamp away from the transport head. ### Claim 20 (depends on 1) Apparatus as in claim 1 including a cam slidably mounted on each transport head, a lift member movably mounted on each transport head and engagable with the cam for movement between extended and retracted positions in response to shifting of the cam, a first fluid cylinder associated with each transport assembly engagable with the cam in the head of such assembly for shifting the cam in one direction, a second fluid cylinder and a plurality of operative connections joining said second fluid cylinder and the cams in said heads for shifting said cams in a direction opposite said one direction. ### Claim 21 (depends on 20) Apparatus as in claim 20 wherein said second fluid cylinder is located on said axis. ### Claim 22 (depends on 20) Apparatus as in claim 20 wherein said substrate support includes an elongate member extending along said axis through said second fluid cylinder. ### Claim 23 (depends on 1) Apparatus as in claim 1 wherein each transport head includes a lead strip alignment member engagable with a lead strip segment held on the head by the clamp means to align such segment for mounting on the edge of a substrate held on the substrate support. ### Claim 24 (depends on 23) Apparatus as in claim 23 wherein said alignment member comprises a pin extendable into a pilot hole formed in the carrier strip of a lead strip segment held on the head by the clamp means and a pin drive for extending and retracting the pin. ### Claim 25 (depends on 1) Apparatus as in claim 1 wherein said first drive means and said clamp drive means are located on said axis. ### Claim 26 (depends on 25) Apparatus as in claim 25 wherein said first drive means is located between the substrate support and said clamp drive means. ### Claim 27 (depends on 1) Apparatus as in claim 1 wherein the integrated circuit support member extends past said first drive means. ### Claim 28 (depends on 27) Apparatus as in claim 27 wherein said support member comprises a vacuum tube. ### Claim 29 Apparatus for simultaneously mounting a plurality of contact leads on the edges of integrated circuit substrates with the contact portions of the leads engaging contact pads spaced along the edges of the substrates, the apparatus including, a) an integrated circuit substrate support located on a central axis; b) a plurality of transport assemblies spaced around the central axis with each transport assembly located outwardly of the substrate support, each transport assembly including a transport head movable between a loading position away from the axis and a mounting position adjacent the axis, first means for securing a plurality of contact leads to each head at a location facing the axis for mounting on the edge of an integrated circuit substrate on the substrate support; c) second means for feeding leads to each transport head when in the loading position; and d) a transport head drive for moving said transport heads between said loading position and said mounting position, said transport head drive including a first drive member, third means for moving the first drive member and first operative connections joining the first drive member and said transport heads. ### Claim 30 (depends on 29) Apparatus as in claim 29 wherein said substrate support means includes a vacuum recess, and including a vacuum source and a vacuum line communicating said source and the vacuum recess. ### Claim 31 (depends on 30) Apparatus as in claim 30 wherein said third means comprises a fluid cylinder on said axis, said vacuum line extending through said fluid cylinder; and said first drive member comprises a second tube surrounding said first tube. ### Claim 32 (depends on 29) Apparatus as in claim 29 wherein said third means comprises a first fluid cylinder mounted on said axis, said cylinder including a piston movable along the axis and said first drive member is mounted on said axis and connected to the piston. ### Claim 33 (depends on 32) Apparatus as in claim 32 including fourth means for releasing the contact leads from the transport heads, and a release drive for the fourth means comprising a second fluid cylinder mounted on said axis. ### Claim 34 (depends on 33) Apparatus as in claim 33 wherein sad operative connections each include a plurality of arms each joining the first drive member and said transport heads. ### Claim 35 (depends on 33) Apparatus as in claim 33 wherein said fourth means includes a cam member movable along said axis and connected to said second cylinder and a follower member on each transfer head engagable with said cam member. ### Claim 36 The method of mounting lead strip segments on the edges of rectangular integrated circuit substrates, comprising the steps of: a) positioning a rectangular integrated circuit substrate on a central substrate support, the substrate having edges with spaced contact pads extending along the edges; b) feeding a lead strip segment having free lead ends to each of a plurality of transfer heads spaced around the integrated circuit substrate, the free ends of the leads in such segments extending toward an adjacent edge of the integrated circuit substrate; c) clamping each lead strip segment in position on its respective transfer head; d) simultaneously moving the transfer heads toward the integrated circuit substrate to position the free ends of the leads in the lead strip segments clamped on the transfer heads over the contact pads on the adjacent edges of the integrated circuit substrate; e) forming physical connections between the lead ends and the contact pads on the substrates; and f) releasing the lead strip segments from the transfer heads. ### Claim 37 (depends on 36) The method of claim 36 including the step of, g) clipping the ends of the leads to opposite sides of the substrate in physical contact with contact pads. ### Claim 38 (depends on 36) The method of claim 36 including the step of, g) soldering the lead ends to contact pads on the substrate. ### Claim 39 (depends on 38) The method of claim 38 including performing step f) before step g). ### Claim 40 (depends on 38) The method of claim 38 including performing step before step f). ### Claim 41 (depends on 36) The method of claim 36 including the step of, g) positioning the ends of the leads directly over the pads and then moving the ends of the leads and the pads into contact. ### Claim 42 An apparatus for simultaneously mounting lead strip segments onto at least two edges of an integrated circuit substrate having a plurality of spaced contact pads spaced along the edges of the substrate with the contact portions of the leads engaging the contact pads, the apparatus comprising: a) an integrated circuit substrate support located on a fixed axis; b) a lead strip insertion means for simultaneously mounting leads onto each edge of an integrated circuit substrate located on the substrate support, each said means movable between a mounting position adjacent the support and a receiving position remote from the support; c) a lead strip supply mechanism for supplying lead strip segments to the insertion means when the insertion means is in said receiving position; and d) a drive for moving the insertion means between said receiving and mounting positions, said drive including a first drive member movable along said axis and operative connections joining said drive member and each said insertion means. ### Claim 43 (depends on 42) An apparatus as in claim 42 wherein said lead strip insertion means comprises a plurality of transport assemblies spaced around the fixed axis, each assembly having a transport head movable between said positions in synchronization with the other transport heads. ### Claim 44 (depends on 43) An apparatus as in claim 43 wherein there are four transport assemblies spaced 90 degrees apart around the fixed axis. ### Claim 45 (depends on 43) An apparatus as in claim 43 wherein each transport assembly includes a clamp for maintaining the lead strip on the transport head during movement of the head to the mounting position, said clamp being movable between an open position when the transport head is in the receiving position and a clamping position when the transport head is moved away from the receiving position. ### Claim 46 The method of mounting a plurality of leads onto the edges of integrated circuit substrates having spaced opposed sides joined by edges and contact pads along the edges, said method comprising the steps of: a) positioning an integrated circuit substrate on a substrate support located along the fixed axis; b) feeding a plurality of spaced leads to each of a plurality of transport heads spaced around the fixed axis with each transport head adjacent a respective edge of the substrate and with lead contact ends of the leads facing the adjacent edge of the substrate; c) simultaneously moving each transport head toward its respective substrate edge to position the free ends of the leads above the edges of the substrate. d) relatively moving the substrate and leads to bring the ends of the leads into contact with the pads on the edges of the substrate; and e) forming electrical connections between the contact pads and the ends of the leads. ### Claim 47 (depends on 46) The method of claim 46 including the step of positioning the substrate below the free ends of the leads before moving the transport heads toward the substrate; and moving the substrate up so that the pads along the edges of the substrate contact the lead contact ends. ### Claim 48 (depends on 46) The method of claim 46 including the steps of clamping each lead strip segment in a position on its respective transfer head and releasing the lead strip segments from the position on its respective transfer head after forming electrical connections between the lead ends and the contact pads. ### Claim 49 (depends on 46) The method of claim 46 including the step of clipping the free ends of the leads onto opposite sides of the substrate as each lead strip is moved toward its respective edge of the substrate.