Unreinforced polyamide molding materials
AssigneeBASF SE
InventorsWalter Goetz, Walter Betz
Life of this patent
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Abstract
Unreinforced polyamide molding materials contain A) from 60 to 100% by weight of a mixture consisting of A.sub.1) from 97.5 to 99.85% by weight of one or more polyamides, A.sub.2) from 0.05 to 0.5% by weight of aluminum hydroxide and A.sub.3) from 0.1 to 2% by weight of one or more esters or amides of saturated or unsaturated aliphatic carboxylic acids of 10 to 40 carbon atoms with aliphatic saturated alcohols or amines of 2 to 40 carbon atoms and, based on the total weight of the polyamide molding material, B) from 0 to 40% by weight of a toughened polymer and C) from 0 to 10% by weight of conventional additives in effective amounts.
Claims7
An unreinforced polyamide molding material, consisting essentially of
- A) from 60 to 100% by weight of a mixture consisting of
- A.sub.1) from 97.5 to 99.85% by weight of one or more polyamides,
- A.sub.2) from 0.05 to 0.5% by weight of aluminum hydroxide and
- A.sub.3) from 0.1 to 2% by weight of one or more esters or amides of saturated or unsaturated aliphatic carboxylic acids of 10 to 40 carbon atoms with aliphatic saturated alcohols or a/nines of 2 to 40 carbon atoms
- and, based on the total weight of the polyamide molding material,
- B) from 0 to 40% by weight of an elastomeric polymer.
Dependencies are inferred from the claim text.