Anti-oxidant coatings for copper foils
AssigneeGould Electronics Inc.
InventorDino F. DiFranco
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Abstract
This invention relates to a method for increasing oxidation protection and decreasing the nonuniformities in an electrodeposited layer of a treated copper foil or treated copper-based alloy foil, comprising depositing a protective anti-oxidation coating onto at least one surface of said foil from a solution comprising arsenic. The invention also encompasses the copper foil or copper-based alloy foil coated to improve appearance and oxidation resistance of the foil.
Claims15
A method for increasing oxidation protection and decreasing the nonuniformities in an electrodeposited layer of a treated copper foil or treated copper-based alloy foil, comprising electrodepositing a protective anti-oxidation coating onto at least one surface of said foil from a solution comprising ions of chromium and arsenic.
A copper foil having on at least one surface thereof an electrodeposited anti-tarnish layer comprising chromium and a minor effective amount of arsenic said minor effective amount of arsenic being effective to provide said foil improved appearance and resistance to oxidation wherein said foil exhibits increased oxidation resistance as indicated by an HTO rating of about 1.0 to about 2.0 measured at 250.degree. C. for 15 minutes and improved appearance as indicated by a uniformity rating of about 95 percent to about 100 percent.
A foil according to claim 22 wherein said anti-tarnish layer further comprises a major amount of zinc and said layer is adjacent to a shiny side of said copper foil.
Dependencies are inferred from the claim text.