Screen printing apparatus for filling through-holes in circuit board with paste
AssigneeHitachi Techno Engineering Co., Ltd.
InventorsHiroyuki Watanabe, Tetsuji Machita
Life of this patent
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Abstract
Disclosed is a screen printing apparatus for filling minute through-holes in a board with conductive paste or the like by screen printing. When screen printing is performed with this screen printing apparatus, the board is placed on a stage through the intermediation of a film which is supplied to the stage by means of adhesive pads. The adhesive pads are brought into contact with the uppermost one of a plurality of stacked films to catch it by adhesion and then transfer the film to a position above the stage. Films are caught one after another by adhesion.
Claims7
A screen printing apparatus comprising:
- a support on which a circuit board having through-holes formed therein is placed with a filter interposed there between;
- a screen mask through which the through-holes in the circuit board are filled with paste;
- means for storing filters together in stacked relationship;
- adhesion means for taking the uppermost one of the stacked filters by adhesion;
- means for separating the filter adhering to said adhesion means therefrom;
- filter attraction/dropping means for attracting by suction the filter adhering to the adhesion means and for causing the thus attracted filter to fall by releasing the suction;
- and means for moving said attraction/dropping means to a position above said support.
Dependencies are inferred from the claim text.