Apparatus for producing semiconductor device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsToshio Takeuchi, Ichiro Hayashi, Shuichi Osaka
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Abstract
A method of and an apparatus for producing semiconductor devices, in which a semiconductor wafer is adhered to an ultraviolet tape the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet tape being adhered to a frame ring so that the semiconductor wafer is fixed to the frame ring through the ultraviolet tape. Successive semiconductor wafers thus fixed to respective frame rings are subjected to a series of steps including dicing, breaking and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided into dices and held by the ultraviolet tape with reduced adhesiveness is sent to a next step such as die-bonding step.
Claims5
An apparatus for producing semiconductor devices by dividing a semiconductor wafer having a surface into a plurality of dice comprising:
- a wafer mounting means for adhering a semiconductor wafer to an ultraviolet sensitive tape which is adhered to a ring frame;
- dicing means for scribing cut lines in said semiconductor wafer for dividing said semiconductor wafer into a plurality of dice;
- a breaking jig for breaking said semiconductor wafer along the cut lines scribed therein by plunging against the ultraviolet sensitive tape opposite the cut lines scribed in said wafer;
- ultraviolet irradiation means for irradiating said ultraviolet sensitive tape with ultraviolet rays to reduce the adhesion of said ultraviolet sensitive tape;
- and
- conveying means for conveying said semiconductor wafer from said wafer mounting means to said ultraviolet irradiation means through said dicing means and said breaking jig while said semiconductor wafer is adhered to said ring frame.
Dependencies are inferred from the claim text.