Concave soldering iron tip and method of soldering using same
AssigneePace Incorporated
InventorMark Cannon
Life of this patent
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Abstract
In accordance with a preferred embodiment of the present invention, a concavity of an elliptical shape is formed in a chisel-shaped soldering tip to create a reservoir in which a quantity of molten solder is retained by surface tension. In a preferred method of use, the leads of an electronic component and the lands of a circuit board to which they are to be electrically connected are pretreated with flux. The tip, with a blob of solder in its concavity, is drawn along the lead/land region with the blob of molten solder making contact therewith, so that molten solder is wicked into the region, and joints are formed between the leads the lands.
Claims8
A soldering tip for a hand-held soldering device, comprising a rod of thermally conductive material having an oblique surface formed at one end thereof, and a concavity formed in said oblique surface, wherein said concavity has an elliptical perimetric shape and an arcuate cross-sectional shape, and wherein said concavity forms a reservoir means for holding a quantity of solder therein by surface tension.
In a hand-held soldering device of the type having a hand-holdable unit with an electrical heater therein and at least one soldering tip that is detachably attachable to the hand-holdable unit in heat transfer relationship to said electrical heater, the improvement for maximizing the quantity of solder holdable on said tip without dripping, comprising said soldering tip being formed of a rod of thermally conductive material having an oblique surface formed at one end thereof, and a concavity formed in said oblique surface, wherein said concavity has an elliptical perimetric shape and an arcuate cross-sectional shape, and wherein said concavity forms a reservoir means for holding a quantity of solder therein by surface tension.
Dependencies are inferred from the claim text.