Cooling system for cooling a solid-state imaging device

A cooling system for cooling heat-producing electronic devices included in an electronic apparatus having a body with a chamber therein containing the heat-producing electronic devices, said cooling system comprising:

• electronic cooling devices disposed respectively near the heat-producing electronic devices;
• buffering heat conducting mechanisms connecting the heat-producing electronic devices respectively to the electronic cooling devices and each including first and second members of highly heat-conductive material having mating, part-spherical surfaces which are universally slidable relative to each other about a common center, elastic means urging said part-spherical surfaces toward each other so as to maintain efficient heat conduction thereacross in the event of the angular shifting of said heat-producing electronic devices relative to the respective electronic cooling devices, and highly heat-conductive connecting means between said first member and the respective heat-producing electronic device and between said second member and the respective electronic cooling device, one of said connecting means having mating cylindrical surfaces which are slidable relative to each other in an axial direction passing through said common center for accommodating relative bodily movements of each of said heat-producing electronic devices and the respective electronic cooling device in said axial direction;
• a partition wall extended in said chamber of the body so as to form an air passage for forced-air cooling;
• a motor-driven fan disposed in said air passage;
• and
• a heat radiating coil unit formed of a small tube coiled in loops and a heat conveying fluid sealed in the small tube, said coil unit having heat absorbing portions with heat-conductive connections to the electronic cooling devices, and a heat radiating portion disposed in said air passage.