# US 5,331,514 A · Integrated-circuit package

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- Number: US 5,331,514 A
- Document ID: US5331514A
- Status: Granted
- Kind: A
- Application number: 07/923,512
- Filed: 1992-08-03
- Granted: 1994-07-19
- Earliest claimed: 1991-08-05
- Assignees: Ngk Spark Plug Co., Ltd.
- Inventors: Masao Kuroda
- Web page: https://patentgrep.com/patent/US5331514A

## CPC

- H01R 12/00: Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures (printed connections to, or between, printed circuits H05K1/11)
- H05K 7/1084: {pin grid array package carriers}
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/635: {Through-vias}
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An object to the present invention is to provide an integrated-circuit package in which crosstalk can be reduced and impedance matching can be made. According to the present invention, conductive poles are grid-like arranged equidistantly in rows respectively in the vertical and transversal directions of an insulating substrate. The conductive poles are classified into signal conductive poles which are electrically connected to electrodes of the integrated circuit and the mother board, and earthed ground conductive poles arranged so as to adjacently surround the signal conductive poles.

## Claims

### Claim 1

An integrated circuit package comprising:
a plate-like insulating substrate; and
a plurality of conductive poles including signal conductive poles and ground conductive poles, said signal and ground conductive poles penetrated into said plate-like insulating substrate,
wherein at least one of said signal conductive poles is surrounded by at least some of said ground conductive poles.

### Claim 2 (depends on 1)

The integrated circuit package as claimed in claim 1, wherein said conductive poles are arranged equidistantly in rows respectively in vertical and transversal directions of said insulating substrate.

### Claim 3 (depends on 2)

The integrated circuit package as claimed in claim 2, wherein said ground conductive poles are located to form a reference square about said one signal conductive pole.

### Claim 4 (depends on 2)

The integrated circuit package of claim 2, wherein said conductive poles are located to form a reference polygon about said one signal conductive pole.

### Claim 5 (depends on 1)

The integrated circuit package as claimed in claim 1, further comprising:
an insulating layer disposed on one side of said plate like substrate; and
an integrated circuit mounted on a surface of said insulating layer,
wherein said ground poles extend between said insulating layer and said integrated circuit through said plate like insulating substrate.

### Claim 6

An integrated circuit package comprising:
a plate-like insulating substrate; and
a plurality of conductive poles including signal conductive poles and ground conductive poles, said signal conductive poles penetrated into said plate-like insulating substrate,
wherein one of said ground conductive poles is disposed between said signal conductive poles adjacently arranged.

### Claim 7 (depends on 1)

The integrated circuit package of claim 1 wherein each of said signal conductive poles is surrounded by ground conductive poles.