Electrically and thermally enhanced integrated-circuit package

An improved thermally-enhanced package assembly for an integrated-circuit die packaged in a molded plastic package, comprising:

• an integrated-circuit die;
• a thermally conductive, electrically-insulated substrate having a top surface upon which said integrated-circuit die is attached in a die-up configuration at a central portion of said substrate;
• a lead frame having inwardly-extending bonding fingers, where the bottom surfaces of said bonding fingers are attached to said top surface of said thermally conductive, electrically-insulated substrate;
• an insulating layer positioned over said bonding fingers of said lead frame along the outer margins of said top surface of said thermally conductive, electrically-insulated substrate;
• a conductive layer positioned over said insulating layer;
• and
• one or more bonding wires connected between respective bonding pads on said integrated-circuit die and said conductive layer.

A plastic encapsulated electrically and thermally enhanced integrated-circuit package, comprising:

• an integrated-circuit die;
• a thermally conductive, electrically-insulated substrate having a top surface upon which said integrated-circuit die is attached in a die-up configuration at a central region thereof;
• a lead frame having inwardly-extending leads with bonding fingers at the inner ends thereof, where the bottom surfaces of said leads are attached to said top surface of said thermally conductive, electrically-insulated substrate;
• a layer of insulating material bonded to the top side of said bonding fingers of said lead frame, such that said bonding fingers are disposed between said layer of insulating material and said top surface of said thermally conductive, electrically-insulated substrate, and such that said layer of insulating material peripherally surrounds said integrated-circuit die;
• a conductive layer bonded on top of said layer of insulating material such that said insulating layer is disposed between said conductive layer and said bonding fingers;
• means for electrically connecting said integrated-circuit die and said conductive layer;
• and
• a molded package body formed of a plastic material, which is molded around said integrated-circuit die, said thermally conductive, electrically-insulated substrate, said insulating and conductive layers, and said inwardly extending leads.