Surface acoustic wave device and communication device using the same
AssigneeHitachi, Ltd.
InventorsHiroaki Ikeda, Takashi Shiba, Osamu Hikino
Life of this patent
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AssigneeHitachi, Ltd.
InventorsHiroaki Ikeda, Takashi Shiba, Osamu Hikino
Estimating the term…
In an interdigital electrode of a surface acoustic wave device having nonexciting portions formed by removing fingers, fingers having an excitation source located nearest to a nonexciting portion in between are so positioned as to approach the nonexciting portion as compared with arrangement pitch of other fingers. Fingers having an excitation source located nearest to an end of the electrode in between are so positioned as to approach the end of the interdigital electrode as compared with arrangement pitch of other fingers. Fingers having an excitation source located in the central portion of the electrode group in between are so positioned as to approach each other as compared with arrangement pitch of other fingers.
A surface acoustic wave device comprising a surface acoustic wave substrate and a pair of interdigital electrodes formed on said substrate, each of said electrodes having a bus bar and a plurality of electrode fingers extending from said bus bar generally perpendicular thereto and interdigitated with electrode fingers of the other electrode so that finger pairs are formed between adjacent electrode fingers extending from different bus bars, wherein:
A surface acoustic wave device comprising a surface acoustic wave substrate and a pair of interdigital electrodes formed on said substrate, each of said electrodes having a bus bar and a plurality of electrode fingers extending from said bus bar generally perpendicular thereto and interdigitated with electrode fingers of the other electrode so that finger pairs are formed between adjacent electrode fingers extending from different bus bars, wherein:
Dependencies are inferred from the claim text.