Lead-on-chip inner lead bonding lead frame method and apparatus
AssigneeTexas Instruments Incorporated
InventorsBoon C. Teo, Tjandra Karta, Siu W. Low
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Abstract
A multi-level lead frame configuration (114) for an integrated circuit chip (116) comprises a main lead frame (115) having a plurality of lead frame bond fingers (122 and 124) that directly connect to a plurality of bond pads (126) on the integrated circuit chip (116). Associated with the main lead frame (115) is a bus bar lead frame (128 and 130) having a plurality of bus bar lead fingers (118 and 120) that directly connect to a second plurality of inner bond pads (126) on the integrated circuit chip (116). The bus bar bond fingers (118 and 120) associate with the main lead frame (115) and main lead frame bond fingers (122 and 124) to permit a lead-on-chip configuration of the main lead frame and the bus bar lead frame.
Claims7
A device, comprising:
- a semiconductor device having bond pads located in at least one center row of a surface of said semiconductor device;
- a plurality of bond fingers each having a first end directly connected to a respective one of a first plurality of said bond pads and a second end for connection to external circuitry;
- and
- at least one bus bar having a plurality of bus bar bond fingers for directly connecting to a second plurality of said bond pads and at least one bus bar bond finger for connection to external circuitry.
Dependencies are inferred from the claim text.