Bimodal cured intermixed polymeric networks which are stable at high temperature
AssigneeThree Bond Co., Ltd.
InventorsVincent D. McGinniss, James L. White, Hiroyuki Mikuni
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AssigneeThree Bond Co., Ltd.
InventorsVincent D. McGinniss, James L. White, Hiroyuki Mikuni
Estimating the term…
The present invention is directed to a non-emissive, bimodal cured polymeric network which has an onset degradation temperature that is about 100.degree. C. above the onset degradation temperature of a base polymer. The novel cured polymeric network comprises the cured reaction product of the following ingredients: (a) combination of one or more liquid carrier monomers or prepolymers which combination is reactive to form a base polymer by exposure to ultraviolet (UV) radiation in the presence of a UV photosensitizer at a temperature, T.sub.uv ; and (b) between about 10 and 100 wt-% based on ingredient (a) of a combination of one or more monomers or prepolymers which combination is reactive to form a cured high temperature stable polymer by heating at a temperature, T.sub..DELTA.. Ingredient (b) is soluble or dispersible in ingredient (a) at a temperature, T.sub.s, wherein T.sub.s is equal to or lower than T.sub.uv, and T.sub.uv is at least about 50.degree. C. lower than T.sub..DELTA..
A non-emissive, bimodal-cured, polymeric network which has an onset degradation temperature that is about 100.degree. C. above the onset degradation temperature of a base polymer, and which is the cured reaction product of a mixture of the following ingredients:
A method for curing a bimodual-curable formation to form a polymeric network which has an onset degradation temperature that is about 100.degree. C. above the degradation temperature of a base polymer, which comprises the steps of:
Dependencies are inferred from the claim text.