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AssigneeNippon Paint Co., Ltd.
InventorsChitoshi Kawaguchi, Seiji Arimatsu, Katsuji Konishi, Kazunori Kanda
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The present invention provides an improved process by which dissolved oxygen is effectively removed from a photosensitive resin layer of a photosensitive resin plate. The process comprises preliminarily exposing the photosensitive resin to light to quench oxygen dissolved in said photosensitive resin layer before conducting a main exposure. The photosensitive resin layer is prepared from a photosensitive resin composition which comprises: (a) a polymer binder, (b) a radically polymerizable monomer, (c) a sensitizing dye, and (d) a photopolymerization initiator which is excited by a light of a different wave length from a light exciting the sensitizing dye. The preliminary exposure is conducted with a light only exciting the sensitizing dye and the main exposure is conducted with a light exciting the photopolymerization initiator.
A process for exposing a photosensitive resin plate comprising a substrate and a photosensitive resin layer on said substrate, which process comprises preliminarily exposing said resin plate to light to quench oxygen dissolved in said photosensitive resin layer and then conducting a main exposure, wherein said photosensitive resin layer has a thickness of 0.1 to 10 mm and is prepared from a photosensitive resin composition which comprises:
Dependencies are inferred from the claim text.