Back to results
US 5,330,881 AGranted
Microlithographic method for producing thick, vertically-walled photoresist patterns
AssigneeDigital Equipment Corporation
InventorsAlan L. Sidman, Susan K. Fung
Life of this patent
Estimating the term…
Abstract
A microlithographic resist patterning process which allows generation of very thick, vertically-walled resist patterns which allow for subsequent deposition or etching operations can produce high recording density magnetic thin film heads and other devices requiring high aspect ratios.
Claims11
A method for creating a thick film photoresist mask having vertical walls on a substrate comprising the steps of:
- a. coating a substrate with a thick photoresist compound to form a thick film photoresist layer;
- b. coating the photoresist with a solution to form a barrier layer;
- c. coating the barrier layer with a layer of contrast enhancing compound;
- d. exposing the product of step c to a pattern, wherein a mask pattern image center of focus is positioned only at a single position within the photoresist layer, said single position being about 75% of the way up from the substrate surface toward the surface of the contrast enhancing compound layer, and
- e. stripping the exposed contrast enhancing compound layer and the barrier layer, and developing the exposed photoresist layer.
2 more elements
Dependencies are inferred from the claim text.