Printed circuit substrate with projected electrode and connection method
AssigneeNitto Denko Corporation
InventorsKazuo Ouchi, Masakazu Sugimoto
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Abstract
A printed circuit substrate with projected electrode and a connection method using the same are disclosed. The printed circuit substrate comprises an insulating substrate having formed on one surface or both surfaces thereof an electrically conductive circuit, wherein at least one projected electrode comprising a metallic substance is formed at the side of the end portion of the electrically conductive circuit.
Claims3
A printed circuit substrate with at least one projected electrode comprising an insulating substrate having formed on one surface or both surfaces thereof an electrically conductive circuit, wherein at least one projected electrode comprising a metallic substance is formed at the side of the end portion of the electrically conductive circuit.
Dependencies are inferred from the claim text.