Process for tinning electrically conductive wire
AssigneeUnited Technologies Corporation
InventorsAnthony M. Monteiro, Stephen M. Hilliard, Ralph L. Ferraro
Life of this patent
Estimating the term…
Abstract
A process for tinning plated wire involves first the placing of the wire in a suitable chemical flux for a period of time, the wire is then immersed for a period of time into a static solder pot having molten solder therein, the wire is then re-immersed into the chemical flux for a period of time, and finally the wire is immersed for a period of time into an ultrasonic solder pot having molten solder therein, the wire when removed from the ultrasonic pot being sufficiently tinned such that the solder has formed a suitable intermolecular bond to the plating in accordance with typical bonding criteria.
Claims19
A method of applying solder to a nickel plated wire, comprising the steps
- firstly, immersing the wire in a chemical flux for a period of time;
- next, immersing the wire for a period of time into a static solder pot having molten solder therein and with no ultrasonic agitation operational;
- next, immersing the wire into a chemical flux for a period of time;
- and
- immersing the wire for a period of time into an ultrasonic solder pot having molten solder therein and with ultrasonic agitation operational, the wire when removed from the ultrasonic solder pot being sufficiently coated with the molten solder such that the solder has formed a suitable intermolecular bond to the nickel plating.
A method of applying solder to a nickel plated wire conductor, comprising the steps of:
- firstly, immersing a portion of the conductor in a chemical flux for a period of time;
- next, immersing the conductor portion for a period of time into a static solder pot having molten solder therein and with no ultrasonic agitation operational;
- next, immersing the conductor portion into a chemical flux for a period of time;
- and
- immersing the conductor portion for a period of time into an ultrasonic solder pot having molten solder therein and with ultrasonic agitation operational, the conductor portion when removed from the ultrasonic solder pot being sufficiently coated with the molten solder such that the solder when cooled has formed a suitable intermolecular bond to the plating.
Dependencies are inferred from the claim text.