Anisotropic conductive adhesive film
AssigneeMinnesota Mining and Manufacturing Company
InventorsKenji Emori, Yoshihiko Tasaka
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Abstract
A composition for forming a moisture resistant, anisotropic conductive film having a rapid curing speed, high heat resistance, high humidity resistance, long shelf life and excellent repairability comprising an adhesive composition containing about 100 parts cyanate ester, from about 0.01 part to 10 parts of a curing catalyst, from about 10 parts to about 300 parts of a film-formable thermoplastic resin, and from about 10 to about 500 parts of an epoxy resin, and from about 0.1 part to about 20 parts conductive particles per 100 parts total adhesive composition.
Claims17
A moisture resistant anisotropically electrically conductive adhesive comprising:
- a) about 100 parts of cyanate ester resin, including one or more cyanate ester compounds,
- b) from about 10 to about 300 parts of a film formable thermoplastic resin,
- c) from about 10 to about 500 parts of an epoxy resin,
- d) from about 0.01 to about 10 parts of an organometallic catalyst, wherein said catalyst contains at least one carbon atom covalently bonded to a transition metal atom, and
- e) from about 0.1 to about 20 parts conductive particles selected from the group consisting of metal particles, including coagulated metal particles, and metal-covered polymeric particles per 100 parts total weight of said adhesive,
- said adhesive having been cured in 60 seconds or less at 180.degree. C.
Dependencies are inferred from the claim text.