Method for cleaning rosin-base solder flux
AssigneeArakawa Chemical Industries, Ltd.
InventorsMachio Chihara, Jiro Mizuya, Tatsuya Okumura, Takashi Tanaka
Life of this patent
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Abstract
A cleaning method for removing a rosin-base solder flux, the method including bringing a cleaning agent into contact with the flux on a printed wiring board, the cleaning agent including a mixture of (A) at least one glycol ether compound represented by the formula ##STR1## wherein R.sup.1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R.sup.2 is an alkyl group having 1 to 5 carbon atoms, R.sup.3 is a hydrogen atom or a methyl group and n is an integer of 2 to 4, and (B) at least one nonionic surfactant.
Claims15
A cleaning method for removing a rosin-base solder flux, the method comprising bringing a cleaning agent into contact with the flux on a printed wiring board, the cleaning agent consisting essentially of a mixture of
- (A) at least one glycol ether compound represented by the formula ##STR3## wherein R.sup.1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R.sup.2 is an alkyl group having 1 to 5 carbon atoms, R.sup.3 is a hydrogen atom or a methyl group and n is an integer of 2 to 4, and
- (B) at least one nonionic surfactant.
A cleaning method for removing a rosin-base solder flux, the method comprising bringing a cleaning agent into contact with the flux on a printed wiring board, the cleaning agent consisting essentially of water and a mixture of
- (A) at least one glycol ether compound represented by the formula ##STR4## wherein R.sup.1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R.sup.2 is an alkyl group having 1 to 5 carbon atoms, R.sup.3 is a hydrogen atom or a methyl group and n is an integer of 2 to 4, and
- (B) at least one nonionic surfactant.
Dependencies are inferred from the claim text.