Socket for stacking integrated circuit chips

A socket for supporting an integrated circuit chip and electrically connecting said chip to circuit traces on a substrate, said chip having electrical leads extending therefrom in respective outward directions in a spaced relationship, said socket comprising:

• a dielectric base defining a top surface for supporting said chip, and a bottom surface, the base holding a plurality of electrical contacts, each of said contacts having a foot portion which extends below the bottom surface for electrical connection with one of said traces, and a main body portion which extends above the top surface for electrical connection with one of said leads, said body portions being associated with respective said leads, each of the main body portions having a solder coating on a side thereof, said solder coated sides being in a spaced relationship corresponding to the spaced relationship of said leads and extending beside their respective said leads in respective directions parallel to the respective outward directions of their respective said leads such that said sides are in abutting relationship with their respective said leads when said chip is disposed in said socket, whereby said contacts are electrically connectable with said leads by reflow of said solder coating.