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US 5,330,089 AGranted
Polar bond head
AssigneeTexas Instruments Incorporated
InventorsJohn W. Orcutt, Galle Lin
Life of this patent
Estimating the term…
Abstract
A polar motion bond head for bonding semiconductor devices includes voice coil motors for providing positioning motion to the bond head, and a vision system that has an optical path that allows the camera to see all polar positions with the image staying on the camera centerline.
Claims25
A bonder with a polar motion bond head for bonding semiconductor devices, comprising:
- a bond head frame assembly including a bond head secured to a mounting frame on which the bond head frame assembly is mounted, and a pivot mount attached to the mounting frame, wherein the bond head frame assembly and mounting frame are movable in an arc about the pivot mount;
- a second voice coil motor for moving the bond head in a linear motion;
- a first voice coil motor for moving the bond head and second voice coil motor in an arc in a horizontal plane;
- a third voice coil motor for moving the bond head in a vertical direction;
- and
- an optical viewing system mounted on the mounting frame;
- wherein the bond head is positioned over a location on a semiconductor using polar movement.
4 more elements
A bonder with a polar motion bond head for bonding semiconductor devices, comprising:
- a bond frame assembly including a bond head secured to a movable frame;
- a second voice coil motor for moving the bond head in a linear motion;
- a first voice coil motor for moving the bond head and second voice coil motor in an arc in a horizontal plane;
- a third voice coil motor for moving the bond head in a vertical direction;
- a mounting frame on which the bond head frame assembly is mounted, and a pivot mount attached to the mounting frame, wherein the bond head frame assembly and mounting frame is movable in an arc about the pivot mount;
- a first mirror/prism mounted on the pivot mount;
- a second mirror/prism attached to the bond head and positioned over the bonder bond area;
- and a vision camera position over the first mirror/prism such that the camera viewing field is reflected through the two mirror/prisms to the bonder bond area.
5 more elements
A bonder with a polar motion bond head for bonding semiconductor devices, comprising:
- a bond head;
- a bond head frame assembly including the bond head secured to a mounting frame on which the bond head frame assembly is mounted, and a pivot mount attached to the mounting frame, wherein the bond head frame assembly and mounting frame are movable in an arc about the pivot mount;
- a second voice coil motor for moving the bond head in a linear motion in a direction R;
- a first voice coil motor for moving the bond head and said second voice coil motor through an angle theta in a horizontal plane;
- and
- a third voice coil motor for moving the bond head in a vertical direction;
- wherein the bond head is positioned over a location on a semiconductor using polar motion where, in rectangular coordinates X and Y, X=(R+Delta R) Cosine theta and Y=(R+Delta R) Tangent theta.
4 more elements
A polar motion table apparatus, including:
- a mounting frame, including a bond head frame assembly, and a pivot mount attached to the mounting frame, wherein the bond head frame assembly and mounting frame are movable in an arc about the pivot mount;
- a second voice coil motor for moving the mounting frame in a linear motion in a direction R;
- a first voice coil motor for moving the mounting frame and second voice coil motor through an angle theta in a horizontal plane;
- and
- wherein polar motion of the polar motion table is defined by the angle theta and linear motion R referenced to the pivot mount.
2 more elements
A polar motion bond head for bonding semiconductor devices, comprising:
- a bond head secured to a movable, flexible frame;
- a two axis table on which the movable, flexible frame is mounted;
- and
- a voice coil motor moving the flexible frame in a vertical direction, wherein the flexible frame and voice coil motor are in sliding contact with each other.
1 more element
Dependencies are inferred from the claim text.