Wafer slicing and grinding machine and a method of slicing and grinding wafers
AssigneeSilicon Technology Corporation
InventorRobert E. Steere, Jr.
Life of this patent
Estimating the term…
Abstract
A wafer slicing and grinding machine is provided with a saw blade assembly for the slicing of wafers from an ingot. A grinding stage is also provided for sequentially grinding the rear face of a previously sliced wafer and the front face of an ingot in order to provide a double ground wafer. A transfer chuck and a holding chuck are disposed within the machine to perform movements for effecting a turning over of a wafer for grinding of the rear face of the wafer.
Claims5
A method of slicing and grinding a wafer from an ingot comprising the steps of
- positioning an ingot in a slicing position;
- grinding a face of the ingot in said slicing position;
- slicing a wafer from the ground face of the ingot in said slicing position;
- moving the wafer sliced from the ingot to a holding station;
- thereafter transferring the wafer from said holding station to a position with an unground face thereof in a plane common to the face of the ingot;
- and
- thereafter grinding the unground face of the wafer and the face of the ingot in said plane.
A method of slicing and grinding a wafer from an ingot comprising the steps of
- positioning an ingot on a longitudinal axis in a slicing position;
- grinding a face of the ingot in said slicing position;
- slicing a wafer from the ingot positioned at said slicing position after grinding of the face of the ingot;
- moving the wafer from the ingot positioned at said slicing position after grinding of the face of the ingot;
- moving the wafer sliced form the ingot at said slicing position to a holding station;
- moving a previously sliced wafer to a position with a second face thereof in a plane common to an unground face of the ingot in said slicing position;
- and
- thereafter grinding the second face of the previously sliced wafer and the face of the ingot in said plane.
Dependencies are inferred from the claim text.