Method of manufacturing electronic device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsTakeshi Morita, Osamu Hayashi
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Abstract
An electronic device comprises a housing made of a polycarbonate resin, and a novel double-sided printed circuit board. The printed circuit board has one side embedded in the housing, and the other side exposed to the interior of the housing. A plurality of refractory electronic components are mounted onto one side of the printed circuit board and include a resistor and a capacitor. A plurality of lower refractory electronic components are mounted onto the other side of the housing and include a semiconductor integrated circuit, and a transformer. Preferably, an insulating layer is applied to cover the one side of the printed circuit board and the refractory electronic components. Also, a metal layer is applied to cover the insulating layer and the inner surface of the housing.
Claims11
A method of manufacturing an electronic device, comprising the steps of:
- mounting a plurality of refractory electronic components onto one side of a printed circuit board;
- attaching said printed circuit board temporarily to a male mold so as to face said one side of the printed circuit board against a female mold;
- cooperating with said male mold and said female mold to define a cavity therebetween;
- introducing a resin into said cavity to mold a housing such that said one side of the printed circuit board is embedded in said housing, and the other side of the printed circuit board is exposed to an interior of said housing;
- and
- mounting a plurality of lower refractory electronic components onto the other side of said printed circuit board.
A method of manufacturing an electronic device, comprising the steps of:
- mounting a plurality of refractory electronic components onto one side of a printed circuit board;
- attaching said printed circuit board temporarily to a male mold so as to face said one side of the printed circuit board against a female mold;
- applying an insulating layer to cover said one side of the circuit board and said refractory electronic components;
- applying a metal layer to cover said insulating layer and at least part of said male mold;
- cooperating with said male mold and said female mold to define a cavity therebetween;
- introducing a resin into said cavity to mold a housing such that said one side of the printed circuit board is embedded in said housing, and the other side of the printed circuit board is exposed to an interior of said housing;
- and
- mounting a plurality of lower refractory electronic components onto the other side of said printed circuit board.
Dependencies are inferred from the claim text.