US 5,329,483 AGranted

MOS semiconductor memory device

AssigneeNippon Steel Corporation

InventorsToshio Wada, Shoichi Iwasa

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Abstract

A MOS semiconductor memory device comprises a semiconductor substrate of a first conductive type; impurity diffused regions of a second conductive type different from the first conductive type formed into a plurality of spaced columns extending in a first direction on one surface of the semiconductor substrate and having functions of bit lines; a plurality of columns of element isolation insulating films formed on the impurity diffused regions of the second conductive type, with active regions formed therebetween; a plurality of MOS transistors formed in the active regions aligned in each of a plurality of rows extending in a second direction substantially perpendicular to the first direction, each MOS transistor including a gate formed on a part of the active region with a gate insulating film therebetween and source and drain formed in the impurity diffused regions of the second conductive type; and word lines each connected electrically to the gates of the MOS transistors aligned in each of the rows and extending in the second direction; wherein, when it is assumed that the plurality of columns are named as first and second columns alternately, the sources of the MOS transistors in adjacent two columns at both sides of the bit line of the first column are all connected to the bit line of the first column, and the drains of the MOS transistors in adjacent two columns at both sides of the bit line of the second column are all connected to the bit line of the second column.

Claims4

Dependent claims

A MOS semiconductor memory device comprising:

a semiconductor substrate of a first conductive type;
first impurity diffused regions of a second conductive type different from the first conductive type extending parallel in a first direction on one surface of said semiconductor substrate which function as bit lines;
a plurality of spaced element isolation insulating films formed on said first impurity diffused regions of the second conductive type having active regions formed therebetween;
a plurality of MOS transistors formed in a matrix of columns extending in the first direction and rows extending in a second direction substantially perpendicular to said first direction, each MOS transistor including a gate formed on a part of said active region disposed between adjacent two of said element isolation films having a gate insulating film interposed therebetween, a source and drain formed in respectively two adjacent first impurity diffused regions, on which said two adjacent element isolation insulating films are formed, so that drains of adjacent transistors of a row are connected together and sources of adjacent transistors are connected together to form first and second alternating bit lines, respectively, and a channel region formed in a portion of said semiconductor substrate between the source and the drain;
a plurality of word lines, each connected electrically to said gates of said MOS transistors aligned along one of the rows and extending in said second direction;
and,
a second impurity diffused region of said first conductivity type formed between two adjacent channel regions of the transistors in each of the columns and having a higher impurity concentration than the impurity concentration of said semiconductor substrate for suppressing parasitic channel formation between adjacent transistor of a column.

4 more elements

Dependencies are inferred from the claim text.