3-D communication and interconnect technique for increased number of computational modules in large-scale electronic equipment

An electrical wiring assembly for use in a large-scale electronic equipment comprising:

• an array of rows and columns of rectangular pipe-shaped circuit modules, each of said circuit modules having opposing openings at its both ends, inner wall surfaces on which wiring patterns are defined so that electric circuit components are mounted thereon, and outer wall surfaces provided with external connecting terminals;
• clamping means for clamping said rectangular pipe-shaped circuit modules so as to join adjacent ones of said circuit modules so that said modules are in area-contact with one another on heir outer wall surfaces;
• connecting means, arranged between adjacent ones of said rectangular pipe-shaped circuit modules, for electrically connecting corresponding ones of said external terminals;
• and
• cooling means for causing a cooling medium to flow through said rectangular pipe-shaped circuit modules in a direction parallel with a axis of said modules to suppress or prohibit heat accumulation.