Thermal print head
AssigneeSamsung Electronics Co., Ltd.
InventorsEun-Tak Hong, Hong-Geun Yang, Bae-Won Lee
Life of this patent
Estimating the term…
Abstract
A thermal print head includes a boat on which the substrate, driving IC and printed circuit board are mounted, the boat being mounted on a heat sink which material and shape are changeable according to the mechanical change of the system.
Claims5
A thermal print head, comprising:
- a substrate;
- a heating element mounted on said substrate;
- a printed circuit board;
- a driving integrated circuit mounted on said printed circuit board and connected to said substrate and said printed circuit board by conducting wires;
- a resinoid material covering said driving integrated circuit and said conducting wires;
- a boat performing as a first heat sink with said substrate and said printed circuit board mounted on said boat;
- a second heat sink, wherein said boat mounted on said second heat sink.
A process for making thermal print head, comprising:
- forming a heat element upon a substrate;
- mounting an integrated circuit for driving said heating element upon a printed circuit board;
- forming said substrate, integrated circuit and said printed circuit board on a boat, said boat serving as a first heat sink during said process of forming said substrate, integrated circuit and said printed circuit board on said boat;
- connecting said printed circuit board to said substrate with connecting wires;
- covering said integrated circuit and said conducting wires with a resinoid material;
- and
- mounting said board upon a second heat sink.
A thermal print head for covering electric information to thermal energy to record said electric information on a thermal recording medium, said thermal print head comprising:
- a substrate;
- a heating element mounted on said substrate for generating heat in response to a control signal;
- a printed circuit board for generating a driving signal in response to said electric information;
- a driving integrated circuit mounted on said printed circuit board and electrically connected to said substrate and said printed circuit board, for generating said control signal in response to said driving signal;
- a boat performing as a first heat sink, wherein said printed circuit board and said substrate are mounted on said boat to form an assembled unit;
- a resinoid covering said driving integrated circuit and said electrical connections to said substrate and said printed circuit board, to protect said driving integrated circuit and said electrical connections;
- and
- a second heat sink, wherein said assembled unit is mounted on said second heat sink.
A method of making a thermal print head for converting electric information into thermal energy to record said electric information on a thermal recording medium, said method comprising:
- mounting a heating element on a substrate;
- mounting a driving integrated circuit on a printed circuit board;
- mounting said substrate and said printed circuit board on a boat performing as a first heat sink, to form a unit;
- connecting said driving integrated circuit to said substrate and said printed circuit board with conducting wire;
- applying a resinoid to said driving integrated circuit and said conducting wires;
- and
- mounting said unit on a second heat sink.
Dependencies are inferred from the claim text.