Surface mountable semiconductor device having self loaded solder joints

A surface mountable semiconductor device comprising:

• a package body having a series of outer leads comprising a core of solder wettable material and an overlying layer of solder de-wettable material,
• each of the leads having a substrate mounting end where the core is exposed by the solder de-wettable material and a superior portion adjacent to the package body;
• and
• a solder paste directly overlying and in intimate contact with the solder de-wettable coating and connected to the exposed core at the substrate mounting end, such that
• the solder paste on the leads can flow from the superior portion to the substrate mounting end during a solder flow operation and bond the exposed core at the substrate mounting end to a substrate.

A surface mountable semiconductor device comprising:

• an electronic device enclosed within a package body;
• a plurality of package leads extending from a position proximate the electronic device comprising a core of solder wettable material and an overlying layer of solder de-wettable material, each of the package leads having a substrate mounting end configured for surface mounting the semiconductor device to a substrate wherein the core is exposed by the solder de-wettable material at the substrate mounting end;
• a solder paste directly overlying and in intimate contact with the solder de-wettable material and in contact with the exposed portion of the core at the substrate mounting end;
• and
• a plurality of inner leads coupling the electronic device to the package leads, wherein each inner lead is bonded to the core material of at least one package lead in a region exposed by the solder de-wettable material.