Semiconductor packaging technique yielding increased inner lead count for a given die-receiving area

A patterned layer of conductive lines defining a die-receiving area for packaging a semiconductor die, comprising:

• a plurality of conductive lines, said conductive lines having inner ends;
• the inner ends of said conductive lines defining a certain non-square die-receiving area for mounting a semiconductor die;
• wherein:
• the geometric configuration formed by the inner ends of the conductive lines define a triangular shaped die-receiving area, said die-receiving area having angles alpha, beta, and phi;
• the die-receiving area is triangular;
• and
• the angles alpha, beta and phi are 30.degree., 60.degree., and 90.degree., respectively.

A patterned layer of conductive lines defining a die-receiving area for packaging a semiconductor die, comprising:

• a plurality of conductive lines, said conductive lines having inner ends;
• the inner ends of said conductive lines defining a certain non-square die-receiving area for mounting a semiconductor die;
• wherein:
• the geometric configuration formed by the inner ends of the conductive lines define a trapezoidal shaped die-receiving area.