Burn-in apparatus for semiconductor integrated device

A portable burn-in apparatus for testing electronic components comprising:

• first and second boards having a plurality of sockets each that receive said electronic components, said boards together being a tray for said electronic components after a burn-in test is completed, each electronic component in said sockets being sandwiched between said first and second boards;
• first and second accommodating members each having a heater therein for accommodating said first and second boards with the electronic components to keep a thermal condition therein;
• and
• connection means for connecting said electronic components with a power supply.

A portable burn-in apparatus for testing electronic components comprising:

• first and second boards each having a plurality of sockets for said electronic components, each electronic component being sandwiched between a first socket in said first board and a second socket in said second board, said first and second boards in cooperation forming a tray for said electronic components after a burn-in test is completed;
• a first and a second accommodating members each having a heater for said first and second boards to maintain a thermal condition in said boards, and inner surfaces of said accommodating members abut outer surfaces of said boards;
• and
• connection means for connecting said electronic components with a power supply.