Curable resin composition

Abstract

Disclosed is a curable resin composition comprising (a) 100 parts by weight of a siloxane-amide block copolymer of formula (1): ##STR1## where R.sup.1 is a substituted or unsubstituted divalent hydrocarbon group; R.sup.2 may be the same or different and each is a substituted or unsubstituted monovalent hydrocarbon group; R.sup.3 is substituted or unsubstituted divalent aromatic hydrocarbon group; and m and an each are a number of 1 or more; (b) from 1 to 100 parts by weight of a crosslinking agent containing 2 or more epoxy groups in the molecule, and (c) up to 15 parts by weight of a curable catalyst. The composition can be cured at room temperature and in the absence of moisture in a closed system to give a cured product having high oil resistance and mechanical strength.

Dependencies are inferred from the claim text.