Ceramic circuit board with a curved lead terminal

A ceramic circuit board comprising:

• a ceramic base board;
• a metal circuit plate integrally bonded onto a surface of the ceramic base board through a bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta;
• and
• a semiconductor chip bonded onto a surface of the metal circuit plate, the metal circuit plate being provided with an empty communication hole at a bonding surface between the metal circuit plate and the ceramic base board so as to communicate the bonding surface with an outside of the ceramic base board through the empty communication hole.

A ceramic circuit board comprising:

• a ceramic base board;
• a metal circuit plate integrally bonded onto one surface of the ceramic base board through a first bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta;
• a backing metal plate for preventing thermal deformation of the ceramic base board, which is integrally bonded onto another surface of the ceramic base board through a second bonding layer containing an active metal;
• a semiconductor chip bonded onto a surface of the metal circuit plate through a first solder layer;
• and
• a heat sink for releasing heat, which is bonded onto a surface of the backing copper plate through a second solder layer, the metal circuit plate and the backing metal plate being provided with an empty communication hole respectively formed at each of bonding surfaces so as to communicate the each of the bonding surfaces with an outside of the ceramic base board through the empty communication hole.

A ceramic circuit board comprising:

• a ceramic base board;
• a metal circuit plate integrally bonded onto a surface of the ceramic base board through a bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta;
• and
• a semiconductor chip bonded onto a surface of the metal circuit plate through a solder layer, the metal circuit plate being provided with a groove at a bonding surface directing to the semiconductor chip so as to communicate the bonding surface with an outside of the semiconductor chip through the groove.

A ceramic circuit board comprising:

• a ceramic base board;
• a metal circuit plate integrally bonded onto one surface of the ceramic base board through a first bonding layer containing an active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta;
• a backing metal plate for preventing thermal deformation, which is integrally bonded onto another surface of the ceramic base board through a second bonding layer containing an active metal;
• a semiconductor chip bonded onto a surface of the metal circuit plate through a first solder layer;
• and
• a heat sink for releasing heat, which is bonded onto a surface of the backing metal plate through a second solder layer, the metal circuit plate and the backing metal plate being provided respectively with a groove formed at each of solder layer side surfaces so as to communicate the each of the solder layer side surfaces with an outside of the semiconductor chip through the groove.