Flexible printed circuits
AssigneeMonsanto Company
InventorsAlbert W. Morgan, James P. Brozek, James D. Capistran, Michael T. O'Connor, Jr.
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Abstract
Flexible printed circuits comprising copper circuitry electrolessly deposited on an activated ink coating prepared by heating a wet ink comprising a polymer, e.g. polyvinyl chloride or a butadiene polymer, and a Group 1B or 8 compound, e.g. palladium dichloride, which is adapted to drying at room temperature to a catalytically inert ink. Selective areas of the ink activated by application of heat or light, e.g. a laser, are catalytic to electroless deposition of copper.
Claims5
A printed circuit comprising oxidation resistant, electrolessly-deposited copper circuitry on a flexible film substrate wherein said copper is deposited on a activated ink coating prepared by heating a wet ink comprising a polymer and a Group 1B or 8 compound which is adapted to drying at room temperature to a catalytically inert ink.
A printed circuit comprising oxidation resistant, electrolessly-deposited copper circuitry on a flexible film substrate wherein said copper is deposited on selectively catalytic areas of a catalytically inert coating of a polymer and a Group 1B or 8 compound, wherein said areas are selectively activated.
Dependencies are inferred from the claim text.