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US 5,328,696 AGranted
Devices using silicone pressure sensitive adhesives containing organic wax
AssigneeDow Corning Corporation
InventorRoss A. Noel
Life of this patent
Estimating the term…
Abstract
Hot-melt silicone pressure sensitive adhesive compositions containing organic waxes, methods of using the compositions and devices made using the compositions are disclosed. The hot-melt silicone pressure sensitive adhesive compositions include a mixture of (i) a silicate resin, (ii) a silicone fluid, and (iii) an organic wax having a melting point of between 30.degree. C. and 150.degree. C. The organic wax decreases dynamic viscosity of the adhesive at temperatures equal to or below about 200.degree. C.
Claims10
A matrix transdermal drug delivery device for a bioactive agent, comprising:
- (a) a backing substrate;
- (b) an adhesive matrix atop at least portions of said backing substrate, said adhesive matrix formed of a non-flammable, hot-melt, silicone pressure sensitive adhesive composition having tackiness and adhesiveness containing (i) between about 30 and about 70 percent by weight of a benzene-soluble resinous copolymer containing silicon-bonded hydroxyl radicals and consisting essentially of triorganosiloxy units of the formula R.sub.3 SiO.sub.1/2 and tetra functional siloxy units of the formula SiO.sub.4/2 in a ratio of about 0.6 to 0.9 triorganosiloxy units for each tetra functional siloxy unit present in the copolymer, wherein each R is a monovalent organic radical independently selected from the group consisting of hydrocarbon radicals of from 1 to 6 inclusive carbon atoms;
- (ii) between about 22 and about 60 percent by weight of a polydimethylsiloxane fluid;
- and (iii) between about 1.0 and about 25 percent by weight of an organic wax, all weight percents being based on total composition weight, said wax having a melting point of between about 30.degree. C. and about 150.degree. C., and said organic wax decreasing the dynamic viscosity of the resultant hot-melt silicone pressure sensitive adhesive at temperatures ranging up to about 200.degree. C., and said silicone pressure sensitive adhesive composition including ingredients selected from the group consisting of drugs, excipients, co-solvents, enhancers, and mixtures thereof where the silicone pressure sensitive adhesive composition is compatible with said drugs, excipients, co-solvents and enhancers wherein the silicone pressure sensitive adhesive composition has a tack value between about 50 and 800 g/cm.sup.2 measured using a probe tack tester at a speed of 0.5 cm/second with a 0.5 second dwell time;
- and
- (c) a release liner contacted on the adhesive matrix.
3 more elements
A reservoir transdermal drug delivery device, comprising:
- (a) a backing substrate;
- (b) a reservoir attached to at least portions of the backing substrate, said reservoir containing compositions selected from the group consisting of drugs, excipients, co-solvents, enhancers, and mixtures thereof;
- (c) a non-flammable hot-melt silicone pressure sensitive adhesive composition having tackiness and adhesiveness containing (i) between about 30 and about 70 percent by weight of a benzene-soluble resinous copolymer containing silicon-bonded hydroxyl radicals and consisting essentially of triorganosiloxy units of the formula R.sub.3 SiO.sub.1/2 and tetra functional siloxy units of the formula SiO.sub.4/2 in a ratio of about 0.6 to 0.9 triorganosiloxy units for each tetra functional siloxy unit present in the copolymer, wherein each R is a monovalent organic radical independently selected from the group consisting of hydrocarbon radicals of from 1 to 6 inclusive carbon atoms;
- (ii) between about 22 and about 60 percent by weight polydimethylsiloxane fluid;
- and (iii) between about 1.0 and about 25 percent by weight of an organic wax, all weight percents being based on total composition weight, said wax having a melting point of between about 30.degree. C. and about 150.degree. C., and said wax decreasing dynamic viscosity of the hot-melt silicone pressure sensitive adhesive at temperatures ranging up to about 200.degree. C., wherein the silicone pressure sensitive adhesive composition has a tack value between about 50 and 800 g/cm.sup.2 measured using a probe tack tester at a speed of 0.5 cm/second with a 0.5 second dwell time, coated on top of the reservoir and portions of the backing substrate not covered by the reservoir;
- and
- (d) a release liner attached to the silicone pressure sensitive adhesive.
4 more elements
Dependencies are inferred from the claim text.