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US 5,328,660 AGranted
Lead-free, high temperature, tin based multi-component solder
AssigneeInternational Business Machines Corporation
InventorsStephen G. Gonya, James K. Lake, Randy C. Long, Roger N. Wild
Life of this patent
Estimating the term…
Abstract
Disclosed is a high solidus temperature, high service temperature, high strength multi-component solder alloy containing a major portion of Sn, and effective amounts of Ag, Bi and In. Preferably the solder alloy contains 78.4 weight percent Sn, 2.0 weight % Ag, 9.8 weight % Bi, and 9.8 weight % In.
Claims1
A high solidus temperature, high service temperature, high strength multi-component solder alloy consisting essentially of 78.4 weight percent Sn, 2.0 weight % Ag, 9.8 weight % Bi, and 9.8 weight % In.
Dependencies are inferred from the claim text.