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US 5,328,589 AGranted
Functional fluid additives for acid copper electroplating baths
AssigneeEnthone-OMI, Inc.
InventorSylvia Martin
Life of this patent
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Abstract
A process and composition for high acid/low metal copper electroplating baths with improved leveling, adhesion, ductility and throwing power. The bath includes effective amounts of a functional fluid having at least one ether group derived from an alcohol epoxy or a bisphenol A and containing ethoxy and propoxy functionalities.
Claims21
An improved high acid/low copper electroplating bath for plating of copper onto substrates comprising:
- from about 13 to about 45 g/l copper ions;
- from about 45 to about 262 g/l of an acid with effective amounts of a bath soluble multi-functional polymer said polymer comprising at least three distinct ether groups linked in said polymer wherein one of the ether linkages is derived from an alcohol, a bisphenol A or an epoxy and also comprising propoxy and ethoxy groups said multi-functional polymers providing improved leveling over surface imperfections, improved adhesion and improved plating in low density current areas.
A process for electrolytic depositing of a copper deposit onto a substrate comprising the steps of:
- 1) providing an improved high acid/low copper plating bath having from about 15 to about 45 g/l copper ions, from about 45 to about 262 g/l of an acid and a bath soluble multi-functional polymer having at least one 4 to 10 carbon chain ether group derived from an alcohol and having a bisphenol A or an epoxy, propoxy and ethoxy functionality contained in said solution in effective amounts for leveling of imperfections and good adhesion and ductility;
- 2) providing a substrate for electrolytic plating thereover and immersing said substrate in the bath;
- and
- 3) subjecting said bath to a sufficient electroplating current for depositing the copper deposit on the substrate, wherein the copper deposit provides enough thickness and conductivity to allow any desired further processing of the work.
1 more element
An improved copper electroplating bath for plating of copper onto substrates comprising:
- from about 13 to about 45 g/l copper ions;
- from about 45 to about 262 g/l of an acid;
- effective amounts of brighteners and leveling additives;
- and
- from about 1 to about 2000 mg/l of a functional fluid having the formula:
- (R.sub.1).sub.m --(R.sub.2).sub.n --(R.sub.3).sub.o --R.sub.4
- wherein:
- R.sub.1 is selected from the group consisting of:
- an alkyl ether group derived from an alcohol having from about 4 to about 10 carbon atoms;
- an alkyl ether group derived from a bisphenol A moiety;
- an epoxy moiety;
- or mixtures thereof and m is selected to be from about 1 to about 3;
- R.sub.2 and R.sub.3 are interchangeable in their order within the formula;
- R.sub.2 is selected from the group consisting of:
- ##STR8## and mixtures thereof;
- and R.sub.3 is selected from the group consisting of ##STR9## and mixtures thereof;
- and R.sub.4 is selected from the group consisting of H, CH.sub.3, an alkyl group, a hydroxyalkyl group, alkylether groups having 1 to 2 carbons, a polar alkyl group, an ionic constituent or an alkyl group having an ionic constituent and mixtures thereof wherein n and o are selected such that the ratio of n to o is from about 1/2:1 to about 1:30 and such that the functional fluid has a molecular weight of from about 500 to 10.000.
14 more elements
Dependencies are inferred from the claim text.