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US 5,328,585 AGranted
Linear planar-magnetron sputtering apparatus with reciprocating magnet-array
AssigneePhotran Corporation
InventorsDavid E. Stevenson, Geoffrey H. Humberstone
Life of this patent
Estimating the term…
Abstract
A linear planar-magnetron sputtering cathode comprises a cathode body (22) including two side-walls (104) two end-walls (106) and a target-supporting member (102) attached to the walls. The cathode body encloses a magnet array (40) which may be moved reciprocally in at least one direction relative to the cathode body. A cooling fluid may be flowed through the target supporting member for cooling the target. A cooling fluid may also be flowed through the side-walls and the end-walls for cooling the end walls. A cooled enclosure is thus be provided for the magnet-array.
Claims9
A linear planar-magnetron sputtering apparatus, comprising:
- A rectangular box-shaped cathode body having a length and a width;
- said cathode body including a flat, rectangular base and a flat, rectangular target-supporting member, said base and said target-supporting member attached to and spaced apart by first and second side-walls, and first and second end-walls, and said base, said target supporting member and said side and end-walls forming an enclosure within said cathode body;
- magnetic means within said enclosure for defining an elongated sputtering-zone extending along the length of said-target-supporting member, said magnetic means including a magnet array attached to a flux-return plate;
- said target-supporting member arranged to support on an outer surface thereof a target material to be sputtered, said target material in contact with a predetermined rectangular target area of said outer surface;
- magnet-moving means for providing reciprocal motion of said magnetic means in at both lateral and longitudinal directions relative to said cathode body;
- said magnet-moving means including spaced-apart parallel longitudinal-drive rails attached to said rectangular base and extending in a direction along the length of said cathode body, a magnet-array suspension-platform slidably mounted on said longitudinal drive rails, said suspension-platform having spaced-apart, parallel, lateral-drive rails extending in a direction across the width of said cathode body, and said magnet-array slidably mounted on said lateral-drive rails;
- at least one rotatable longitudinal-drive shaft having first cam means attached thereto, said first cam means slidably engaging first cam-follower means attached to said suspension platform, and at least one rotatable lateral-drive shaft, said lateral-drive shaft having second cam means attached thereto said second cam means slidably engaging second cam-follower means attached to said flux-return plate;
- target cooling means within said target-supporting member for cooling a target during sputtering;
- side-wall cooling means within said side-walls, and end-wall cooling means within said end-walls for cooling said side-walls and said end-walls respectively during sputtering;
- and
- means for mounting said cathode body in a vacuum chamber under vacuum, with said magnet-array and said reciprocal motion providing means at atmospheric pressure.
8 more elements
A linear planar-magnetron sputtering apparatus, comprising:
- a hollow, rectangular, box-shaped cathode body;
- said cathode body including a flat rectangular base, and a flat rectangular target-supporting member, said base and said target-supporting member attached to and spaced apart by first and second side-walls, and first and second end-walls;
- magnetic means within said cathode body for defining and elongated sputtering-zone extending along the length of said target-supporting member;
- means for providing reciprocal motion of said magnetic means in at least one direction relative to said cathode body;
- said target-supporting member including first and second rectangular, parallel plates, each thereof having first and second opposite surfaces and said first plate having on said first surface thereof a rectangular target-area for supporting a target material to be sputtered, said plates arranged, spaced apart, with said second surfaces thereof in a face-to-face relationship to define a rectangular target-cooling space therebetween, said target-cooling-space having about the same area as said target area and aligned therewith;
- each of said side-walls including a side-wall cooling-chamber having input-conduit means in fluid communication therewith and each of said end-walls including an end-wall cooling-chamber having output-conduit means in fluid communication therewith;
- each of said side-wall cooling-chambers having an elongated rectangular shape and including a baffle, said baffle arranged to divide said cooling-chamber into first and second elongated rectangular sub-chambers each thereof having first and second ends, and said first and second sub-chambers in fluid communication with each other at adjacent ends thereof;
- in each of said side-walls, said input-conduit means being in fluid communication with said first sub-chamber therein at a point about midway between the ends thereof, and said target-cooling space being in fluid communication with said second sub-chamber therein at a point about midway between the ends thereof;
- and
- in each of said end-walls, said output-conduit means being in fluid communication with said first sub-chamber therein at a position about midway between the ends thereof and said target-cooling space being in fluid communication with said second sub-chamber therein at a position about midway between the ends thereof
7 more elements
Dependencies are inferred from the claim text.