Sputtering apparatus and process for forming lamination film employing the apparatus
AssigneeCanon Kabushiki Kaisha
InventorsMakoto Kameyama, Kenji Ando
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Abstract
A sputtering apparatus comprises at least one pair of first sputtering targets arranged in counterposition; a second sputtering target provided substantially on a concentric circle having the center axis of the first sputtering targets; and a substrate holder for holding a substrate to be coated with particles of target materials emitted from the first sputtering targets and the second sputtering target, which is provided substantially on another concentric circle having the center axis outside the second sputtering target.
Claims15
A sputtering apparatus comprising at least one pair of first sputtering targets arranged in counterposition about a center axis;
- a second sputtering target provided substantially on a concentric circle having the same center axis as the first sputtering targets;
- and a substrate holder for holding a substrate to be coated with particles of target materials emitted from the first sputtering targets and the second sputtering target, which is provided substantially on another concentric circle having a diameter larger than that of the concentric circle of the second sputtering target.
A process for forming a lamination film comprising the steps of vacuum evacuating a vacuum chamber;
- introducing a sputtering gas into the vacuum chamber;
- applying voltage onto at least one pair of first sputtering targets arranged in counterposition to generate plasma, thereby emitting particles of the material of the first sputtering targets by action of the plasma, and to coat with the particles of the material of first sputtering targets a substrate which is provided substantially on a concentric circle having a center axis of the first sputtering targets;
- and applying voltage onto a second sputtering target provided substantially on another concentric circle having a diameter smaller than that of the concentric circle of the substrate to generate plasma, thereby emitting particles of the second sputtering target by action of the plasma, and to coat the substrate with particles of the material of the second sputtering target.
Dependencies are inferred from the claim text.