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AssigneeMacDermid, Incorporated
InventorsRaymond A. Letize, William J. DeCesare, Lucia Justice
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An alkaline solution for the microetching of copper in the course of printed circuit manufacture is provided by combining components which are a source of cupric ion, ammonium hydroxide and/or a source of ammonium ion, and a compound, other than ammonia, which is a chelator for cupric ion in the alkaline environment of the solution. The microetchant composition is stable, brings about a desired microroughening of the copper surface with minimal removal of copper, is easily regenerated, and does not promote pink ring. When an organosilane through-hole conditioning agent is included in the composition, the composition can be used as a means for effecting in one step the microetching and conditioning steps of a printed circuit through-hole metallization process.
A process for microetching a copper surface to remove copper therefrom and produce a remaining copper surface which is microroughened, comprising contacting said copper surface with a composition comprising the combination, in an aqueous solution, of components comprising a source of cupric ion, ammonium hydroxide and/or a source of ammonium ion, and a chelator for cupric ion other than ammonia selected from the group consisting of monoethanolamine, ehtylenediamine tetraacetic acid, salts of ethylenediamine tetraacetic acid, and mixtures thereof, said contacting beign at a composition temperature of from 85.degree. F. to 130.degree. F., and for a time, and at conditions, effective to achieve such microroughening.
In a process for providing the surfaces of through-holes with a metal coating incident to the fabrication of a printed circuit, wherein a printed circuit material containing through-holes is subjected to steps of microetching, conditioning and metal coating, the improvement comprising effecting said microetching and said conditioning in a single processing step employing an aqueous alkaline solution which comprises a source of cupric ion, ammonium hydroxide and/or a source of ammonium ion, a chelator for cupric ion other than ammonia, and an organosilane through-hole conditioner.
Dependencies are inferred from the claim text.