Composite including an inorganic image and method of transferring such an image

A method of selectively metalizing a polymeric substrate to form a metal/polymer composite having a metal pattern adhered to the surface of the polymer substrate, comprising the steps of:

• a) providing a thermoplastic or thermosetting polymeric substrate having a primary surface;
• b) providing an embossing roll or plate having a surface relief pattern and which can be heated to a temperature above the softening temperature of said polymer;
• c) coating the primary surface of said polymeric substrate with a layer of metallic particles;
• d) hot pressing the embossing plate or roll against the particle coated surface of the polymeric substrate at a temperature and pressure sufficient to embed the metal particles into the primary surface in a pattern which reproduces the surface relief pattern of the embossing roll or plate;
• and
• e) further metalizing the embedded metal particle pattern by dipping the primary surface into a molten metal or by electroplating additional metal onto the embedded metal particles.

A method of making a conductive metal/embossed substrate composite comprising the steps of:

• (a) providing an embossed substrate having a relief surface with a pattern formed therein, said relief surface having a raised surface portion and a recessed surface portion;
• (b) providing a first metal layer on said recessed surface portion;
• (c) thickening said first metal layer by coating a second metal layer to form a surface substantially flush with said raised surface portion;
• (d) providing a layer of an adhesive over at least said surface of said second metal layer;
• (e) providing a transfer substrate over at least said adhesive layer;
• (f) forming a bond between said transfer substrate and said second metal layer which is greater than the bond between said first metal layer and said recessed surface portion;
• and
• (g) separating said first metal layer from said recessed surface portion and thereby transferring said first and second metal layers to said transfer substrate.