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US 5,328,521 AGranted
Kinetic solder paste composition
AssigneeE. I. Du Pont de Nemours and Company
InventorRoupen L. Keusseyan
Life of this patent
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Abstract
A solder paste composition containing (a) 4-96% by weight finely divided particles of eutectic or pseudo-eutectic metal alloy or mixtures; (b) 96-4% by weight finely divided particles of a metal additive consisting of pure metal, mixtures or alloys thereof having a melting point of at least 30.degree. C. greater than the metal alloy in (a); and (c) an organic medium. The paste is particularly useful for surface mounting metallized components to metallized substrates in microelectronic packaging.
Claims10
A solder paste composition comprising:
- (a) 4-96% by weight finely divided particles of eutectic or pseudo-eutectic metal alloy or mixtures;
- (b) 96-4% by weight finely divided particles of a metal additive consisting of pure metal, mixtures or alloys thereof having a melting point of at least 30.degree. C. greater than the metal alloy in (a);
- and
- (c) an organic medium.
1 more element
Dependencies are inferred from the claim text.