Clamping device for mold boards

A clamping device for clamping mold boards together comprising a base including a hole formed in a middle portion thereof, a bracket extended upward therefrom and including a pair of wall members having a space formed therebetween, a chamber communicated with said space and aligned with said hole of said base, a lever having a lower end pivotally coupled between said wall members and an upper end engageable with said bracket, means for biasing said upper end of said bracket to engage with said bracket, said lever including a plurality of teeth formed on said lower end and located within said chamber, and a cover engaged on said bracket for enclosing said bracket and including an upper surface having an opening formed therein on one end of said cover for extending therethrough of said upper end of said lever, said cover having a slit formed along a longitudinal direction of said upper surface and in communication with said opening, whereby, said upper end of said lever is engageable in said slit of said cover, said lower end of said lever is pivotally supported between said wall members by a pin, said cover including a panel extended downwardly therefrom for contacting said bracket wall members, said panel having an aperture formed therethrough for insert of said pin for retaining said cover in place.