Method of and arrangement for bond wire connecting together certain integrated circuit components

In the manufacture of an integrated circuit package including a die which includes an array of die output/input bond pads and which is supported by means including an array of electrically conductive leads, a method of electrically connecting each of said leads with a corresponding one of said die bond pads, comprising the steps of:

• (a) forming an electrically conductive bump on each of said corresponding die bond pads;
• and
• (b) using a thermosonic or thermocompression ball bonding tool, connecting an electrically conductive bonding wire to each lead and its corresponding die bond pad by first ball bonding the free end of each bonding wire to its associated lead and thereafter stitch bonding an opposite end of the bonding wire to the electrically conductive bump on the corresponding die bond pad.

In the manufacture of an integrated circuit package including a first die and a second die, each of which includes an array of die output/input bond pads, a method of electrically connecting each of the bond pads of said first die with a corresponding one of the die bond pads of the second die, comprising the steps of:

• (a) forming an electrically conductive bump on each of the bond pads of the second die wherein each bump is formed by ball bonding an electrically conductive bump wire onto an associated die bond pad using a thermosonic or thermocompression ball bonding tool and thereafter, using the same tool, stitch bonding the bump wire to its ball bonded end at a point on said bump wire immediately adjacent said ball bonded end such that the ball bond and the stitch bond together form said electrically conductive bump;
• and
• (b) using the bonding tool, connecting an electrically conductive bonding wire to each die bond pad of the first die and its corresponding die bond pad of the second die by first ball bonding the free end of each bonding wire to its associated die bond pad of the first die and thereafter stitch bonding an opposite end of the bonding wire to the electrically conductive bump on the corresponding die bond pad of the second die.

In the manufacture of an electronic device including first and second components, a method of electrically connecting said components together, comprising the steps of:

• (a) forming an electrically conductive bump on a first component by ball bonding an electrically conductive wire onto the first component using a thermosonic or thermocompression ball bonding tool and thereafter, using the same tool, stitch bonding the wire to its ball bonded end at a point on said wire immediately adjacent said ball bonded end such that the ball bond and the stitch bond together form said electrically conductive bump;
• and
• (b) using said bonding tool to connect an electrically conductive bonding wire between said first and second components by first ball bonding a free end of the bonding wire to the second component and thereafter stitch bonding a second end of the bonding wire to the electrically conductive bump.